In present work,a novel crack-free Al-Cu-Mg-Si-Ti alloy with synchronous improved tensile properties and hot-cracking resistance was proposed and successfully manufactured by laser powder bed fusion(LPBF).The microstr...In present work,a novel crack-free Al-Cu-Mg-Si-Ti alloy with synchronous improved tensile properties and hot-cracking resistance was proposed and successfully manufactured by laser powder bed fusion(LPBF).The microstructure evolution behaviors and the corresponding strengthening mechanisms were investigated in detail.The LPBF-processed Al-Cu-Mg-Si-Ti alloy presents a heterogeneous microstructure consisting of ultrafine equiaxed grains(UFGs)at the boundary and coarse columnar grains(CGs)at the center of the single molten pool.Pre-precipitated D022-Al 3 Ti particles were found to act as the nuclei to refine the grains at the boundary of the molten pool during solidification process,which is attributed to the low cooling rate providing the sufficient incubation time for the precipitation of D022-Al 3 Ti.There are two orientation relationships(ORs)betweenα-Al and D022-Al 3 Ti,i.e.[001]α-Al//[001]D022-Al3Ti,(200)α-Al//(200)D022-Al3Ti and[1¯1¯2]α-Al//[¯111]D022-Al3Ti,(1¯11)α-Al//(¯11¯2)D022-Al3Ti,which are two of the eight ORs predicted with the E2EM model.Refined grains in present alloy,no matter for UFGs or CG,exhibited high critical hot-cracking stress,which means a strong hot-cracking resistance.Dual-nanoprecipitation of Cu-,Mg-,and Si-rich Q’and S’phases was introduced to enhance the mechanical performance ofα-Al matrix.The as-built sample exhibits superior tensile properties,with the yield strength(YS)of 473±8 MPa,ultimate tensile strength(UTS)of 541±2 MPa and elongation(EI)of 10.9%±1.2%.展开更多
The effects of Ni content on the microstructure and the wetting behavior of Sn-9Zn-xNi solders on Al and Cu substrates, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn-xNi/Cu s...The effects of Ni content on the microstructure and the wetting behavior of Sn-9Zn-xNi solders on Al and Cu substrates, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn-xNi/Cu solder joints, were investigated. The microstructure of Sn-gZn-xNi revealed that tiny Zn and coarsened Ni5Zn21 phases dispersed in theβ-Sn matrix. The wettability of Sn-9Zn-xNi solders on Al substrate was much better than that on Cu substrate. With increasing Ni content, the wettability on Cu substrate was slightly improved but became worse on Al substrate. In the Al/Sn-9Zn-xNi/Cu joints, an Al4.2Cu3.2Zn0.7 intermetallic compound (IMC) layer formed at the Sn-gZn-xNi/Cu interfaces, while an Al-Zn-Sn solid solution layer formed at the Sn-9Zn-xNi/Al interface. The mixed compounds of Ni3Sna and Al3Ni dispersed in the solder matrix and coarsened with increasing Ni content, thus leading to a reduction in shear strength of the Al/Sn-9Zn- xNi/Cu joints. Al particles were segregated at both interfaces in the solder joints. The corrosion potentials of Sn-9Zn-xNi solders continuously increased with increasing Ni content. The Al/Sn-9Zn-0.25Ni/Cu joint was found to have the best electrochemical corrosion resistance in 5% NaCl solution.展开更多
In this study,the microstructure and tensile properties of selective laser melted AlSilOMg at elevated temperature were investigated with focus on the interfacial region.In-situ SEM and in-situ EBSD analysis were prop...In this study,the microstructure and tensile properties of selective laser melted AlSilOMg at elevated temperature were investigated with focus on the interfacial region.In-situ SEM and in-situ EBSD analysis were proposed to characterize the microstructural evolution with temperature.The as-fabricated AlSilOMg sample presents high tensile strength with the ultimate tensile strength(UTS)of~450 MPa and yield strength(YS)of~300 MPa,which results from the mixed strengthening mechanism among grain boundary,solid solution,dislocation and Orowan looping mechanism.When holding at the temperature below 200℃for 30 min,the micro structure presents little change,and only a slight decrement of yield strength appears due to the relief of the residual stress.However,when the holding temperature further increases to 300℃and 400℃,the coarsening and precipitation of Si particles inα-Al matrix occur obviously,which leads to an obvious decrease of solid solution strength.At the same time,matrix softening and the weakness of dislocation strengthening also play important roles.When the holding temperature reaches to 400℃,the yield strength decreases significantly to about 25 MPa which is very similar to the as-cast Al alloy.This might be concluded that the YS is dominated by the matrix materials.Because the softening mechanism counteracts work hardening,the extremely high elongation occurs.展开更多
基金supported by the National Key R&D Program of China(No.2016YFB1100100)the National Natural Sci-ence Foundation of China(No.52005411)the Research Fund of the State Key Laboratory of Solidification Processing(NPU),China(No.2020-TZ-02).One of the authors,Q.Z.Wang,is grateful for the fi-nancial supports provided by the China Scholarship Council(Grant No.202106290075).
文摘In present work,a novel crack-free Al-Cu-Mg-Si-Ti alloy with synchronous improved tensile properties and hot-cracking resistance was proposed and successfully manufactured by laser powder bed fusion(LPBF).The microstructure evolution behaviors and the corresponding strengthening mechanisms were investigated in detail.The LPBF-processed Al-Cu-Mg-Si-Ti alloy presents a heterogeneous microstructure consisting of ultrafine equiaxed grains(UFGs)at the boundary and coarse columnar grains(CGs)at the center of the single molten pool.Pre-precipitated D022-Al 3 Ti particles were found to act as the nuclei to refine the grains at the boundary of the molten pool during solidification process,which is attributed to the low cooling rate providing the sufficient incubation time for the precipitation of D022-Al 3 Ti.There are two orientation relationships(ORs)betweenα-Al and D022-Al 3 Ti,i.e.[001]α-Al//[001]D022-Al3Ti,(200)α-Al//(200)D022-Al3Ti and[1¯1¯2]α-Al//[¯111]D022-Al3Ti,(1¯11)α-Al//(¯11¯2)D022-Al3Ti,which are two of the eight ORs predicted with the E2EM model.Refined grains in present alloy,no matter for UFGs or CG,exhibited high critical hot-cracking stress,which means a strong hot-cracking resistance.Dual-nanoprecipitation of Cu-,Mg-,and Si-rich Q’and S’phases was introduced to enhance the mechanical performance ofα-Al matrix.The as-built sample exhibits superior tensile properties,with the yield strength(YS)of 473±8 MPa,ultimate tensile strength(UTS)of 541±2 MPa and elongation(EI)of 10.9%±1.2%.
基金supported by the National Natural Science Foundation of China (Nos. U0734006 and 51171036)
文摘The effects of Ni content on the microstructure and the wetting behavior of Sn-9Zn-xNi solders on Al and Cu substrates, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn-xNi/Cu solder joints, were investigated. The microstructure of Sn-gZn-xNi revealed that tiny Zn and coarsened Ni5Zn21 phases dispersed in theβ-Sn matrix. The wettability of Sn-9Zn-xNi solders on Al substrate was much better than that on Cu substrate. With increasing Ni content, the wettability on Cu substrate was slightly improved but became worse on Al substrate. In the Al/Sn-9Zn-xNi/Cu joints, an Al4.2Cu3.2Zn0.7 intermetallic compound (IMC) layer formed at the Sn-gZn-xNi/Cu interfaces, while an Al-Zn-Sn solid solution layer formed at the Sn-9Zn-xNi/Al interface. The mixed compounds of Ni3Sna and Al3Ni dispersed in the solder matrix and coarsened with increasing Ni content, thus leading to a reduction in shear strength of the Al/Sn-9Zn- xNi/Cu joints. Al particles were segregated at both interfaces in the solder joints. The corrosion potentials of Sn-9Zn-xNi solders continuously increased with increasing Ni content. The Al/Sn-9Zn-0.25Ni/Cu joint was found to have the best electrochemical corrosion resistance in 5% NaCl solution.
基金supported financially by the National Key Research and Development Programme of China(Nos.2016YFB1100602 and 2016YFB1100100)。
文摘In this study,the microstructure and tensile properties of selective laser melted AlSilOMg at elevated temperature were investigated with focus on the interfacial region.In-situ SEM and in-situ EBSD analysis were proposed to characterize the microstructural evolution with temperature.The as-fabricated AlSilOMg sample presents high tensile strength with the ultimate tensile strength(UTS)of~450 MPa and yield strength(YS)of~300 MPa,which results from the mixed strengthening mechanism among grain boundary,solid solution,dislocation and Orowan looping mechanism.When holding at the temperature below 200℃for 30 min,the micro structure presents little change,and only a slight decrement of yield strength appears due to the relief of the residual stress.However,when the holding temperature further increases to 300℃and 400℃,the coarsening and precipitation of Si particles inα-Al matrix occur obviously,which leads to an obvious decrease of solid solution strength.At the same time,matrix softening and the weakness of dislocation strengthening also play important roles.When the holding temperature reaches to 400℃,the yield strength decreases significantly to about 25 MPa which is very similar to the as-cast Al alloy.This might be concluded that the YS is dominated by the matrix materials.Because the softening mechanism counteracts work hardening,the extremely high elongation occurs.