Tactile sensing has been a key challenge in robotic haptics.Inspired by how human skin sense the stress field with layered structure and distributed mechanoreceptors,we herein propose a design for modular multi-parame...Tactile sensing has been a key challenge in robotic haptics.Inspired by how human skin sense the stress field with layered structure and distributed mechanoreceptors,we herein propose a design for modular multi-parameter perception electronic skin.With the stress field sensing concept,complex tactile signals can be transformed into field information.By analyzing the stress field,the realtime three-dimensional forces can be resolved with 1.8°polar angle resolution and 3.5°azimuthal angle resolution(achieved up to 71 folds of improvement in spatial resolution),we can also detect the hardness of object in contact with the electronic skin.Moreover,we demonstrate random assembly of the sensing arrays and integration of our electronic skin onto differently curved surfaces do not lead to any measurement variation of the stress field.This result reveals that the sensing elements in our electronic skin system can be modularly made and exchanged for specific applications.展开更多
基金supported by the joint funding program of Department of Science and Technology of Guangdong Province and the Innovation and Technology Fund of Hongkong under grant 2021A0505110015by the Science and Technology Innovation Council of Shenzhen under grants KQTD20170810105439418 and JCYJ20200109114237902.
文摘Tactile sensing has been a key challenge in robotic haptics.Inspired by how human skin sense the stress field with layered structure and distributed mechanoreceptors,we herein propose a design for modular multi-parameter perception electronic skin.With the stress field sensing concept,complex tactile signals can be transformed into field information.By analyzing the stress field,the realtime three-dimensional forces can be resolved with 1.8°polar angle resolution and 3.5°azimuthal angle resolution(achieved up to 71 folds of improvement in spatial resolution),we can also detect the hardness of object in contact with the electronic skin.Moreover,we demonstrate random assembly of the sensing arrays and integration of our electronic skin onto differently curved surfaces do not lead to any measurement variation of the stress field.This result reveals that the sensing elements in our electronic skin system can be modularly made and exchanged for specific applications.
