The effect of Cu content on the microstructure,grain orientation and mechanical properties of Sn-xCu(x=0-4.0 wt.%)lead-free solder was studied.Results showed that added Cu induced the formation of intermetallic phases...The effect of Cu content on the microstructure,grain orientation and mechanical properties of Sn-xCu(x=0-4.0 wt.%)lead-free solder was studied.Results showed that added Cu induced the formation of intermetallic phases.Only theη-Cu;Sn;andε-Cu;Sn phases were present in theβ-Sn matrix.For all contents,the strongly preferred orientation of theβ-Sn phase was formed on the{001}plane.In Sn doped with 1.0 wt.%Cu,theη-Cu;Sn;phase exhibited the preferred orientation of{0001}plane,whereas doping with 3.0 or 4.0 wt.%Cu transformed the preferred orientation to the{010}plane.In addition,only the{0001}and{■}planes were present in theε-Cu;Sn phase.The high Cu contents contributed to an increased number of low-angle boundaries,high residual strain,tensile strength and microhardness.展开更多
The aim of this research study was to determine optimal resistance spot brazing parameters for joining between AHSS and AISI 304 stainless steel by using filler metal. The key parameters investigated in this study con...The aim of this research study was to determine optimal resistance spot brazing parameters for joining between AHSS and AISI 304 stainless steel by using filler metal. The key parameters investigated in this study consist of the brazing current, electrode pressure and brazing time. The Taguchi method was applied to the design of experiments. Signal-to-Noise ratio was introduced in the study to identify optimal levels from the process where input parameters yield increased shear strength. Brazing was thus implemented with 5,000A brazing current, 0.70 MPa electrode pressure, and 1.50s brazing time. The maximum shear strength obtained was 54.31 N·mm^-2 in accordance with input parameter settings. In addition, Cu-rich phase and Ag0.4Fe0.6 intermetallic phases were found at the interface zone.展开更多
The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction betwe...The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An r/-Cu6Sn5 intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a CuaSn intermetallic phase between the Cu6Sn5 layer and the copper substrate, e-Cu3Sn with an orthorhombic lattice structure was found together with hexagonal CusSn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range.展开更多
基金Rajamangala University of Technology Rattanakosin and School of Engineering,King Mongkut’s Institute of Technology Ladkrabang for the laboratory support of this research。
文摘The effect of Cu content on the microstructure,grain orientation and mechanical properties of Sn-xCu(x=0-4.0 wt.%)lead-free solder was studied.Results showed that added Cu induced the formation of intermetallic phases.Only theη-Cu;Sn;andε-Cu;Sn phases were present in theβ-Sn matrix.For all contents,the strongly preferred orientation of theβ-Sn phase was formed on the{001}plane.In Sn doped with 1.0 wt.%Cu,theη-Cu;Sn;phase exhibited the preferred orientation of{0001}plane,whereas doping with 3.0 or 4.0 wt.%Cu transformed the preferred orientation to the{010}plane.In addition,only the{0001}and{■}planes were present in theε-Cu;Sn phase.The high Cu contents contributed to an increased number of low-angle boundaries,high residual strain,tensile strength and microhardness.
基金express deep gratitude and sincere appreciation to the National Research Council of Thailand(NRCT under contract number A104/2017 for the financial support of this research
文摘The aim of this research study was to determine optimal resistance spot brazing parameters for joining between AHSS and AISI 304 stainless steel by using filler metal. The key parameters investigated in this study consist of the brazing current, electrode pressure and brazing time. The Taguchi method was applied to the design of experiments. Signal-to-Noise ratio was introduced in the study to identify optimal levels from the process where input parameters yield increased shear strength. Brazing was thus implemented with 5,000A brazing current, 0.70 MPa electrode pressure, and 1.50s brazing time. The maximum shear strength obtained was 54.31 N·mm^-2 in accordance with input parameter settings. In addition, Cu-rich phase and Ag0.4Fe0.6 intermetallic phases were found at the interface zone.
基金the National Research Council of Thailand (NRCT) and the Faculty of Engineering, King Mongkut's Institute of Technology Ladkrabang for providing financial support
文摘The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An r/-Cu6Sn5 intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a CuaSn intermetallic phase between the Cu6Sn5 layer and the copper substrate, e-Cu3Sn with an orthorhombic lattice structure was found together with hexagonal CusSn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range.
