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Auger Electron Spectroscopy and Rut herford Backscattering-Channeling Study of Silicon Nitride Formation by Low Energy N^(+)_(2)Ion Implantation
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作者 CHAI Jian-wei YANG Guo-hua +3 位作者 pan hao-chang CAO Jian-qing ZHU De-zhang XU Hong-jie 《Chinese Physics Letters》 SCIE CAS CSCD 1999年第2期120-122,共3页
Direct nitridation of Si(100)surface by low energy N^(+)_(2)ion beam implantation at room temperature for differention doses and angles of incidence has been investigated by in-situ Auger electron spectroscopy and gla... Direct nitridation of Si(100)surface by low energy N^(+)_(2)ion beam implantation at room temperature for differention doses and angles of incidence has been investigated by in-situ Auger electron spectroscopy and glancing Rutherford backscattering-channeling(RBS-C)measurements.The results show that with increase of N^(+)_(2)ion dose the N concentration in the Si surface increases and reaches to a surface stoichiometry close to that of Si3N4.The saturation dose and the thickness of the silicon nitride layer are related to the N^(+)_(2)ion energy.Complete nitride layer can be formed at incident angles of 0°-30°.At larger angles the degree of nitridation decreases and no nitride layer could be found at incident angles larger than 54°.The RBS-C results also suggest that a heavy damaged layer beneath the surface nitride layer can be formed due to ion beam implantation. 展开更多
关键词 BENEATH Electron IMPLANTATION
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