Part of single crystal 4H-SiC wafers were implanted with 230 keV He+ ion at room temperature (RT) with fluences in the range 1.0 1015 2.0 1016 (0.040.8 dpa). The last single crystal 4H-SiC were implanted with 23...Part of single crystal 4H-SiC wafers were implanted with 230 keV He+ ion at room temperature (RT) with fluences in the range 1.0 1015 2.0 1016 (0.040.8 dpa). The last single crystal 4H-SiC were implanted with 230 keV Si5+ ion at RT with fluences in the range 1.0 1015 1.0 1017 (0.044.0 dpa). Hardness versus maximum penetration depth curves for unimplanted 4H-SiC, and He/Si ion implanted 4H-SiC at different fluences. Nanoindentation was performed to investigate the hardening behavior of single crystals 4H-SiC under irradiation.展开更多
文摘Part of single crystal 4H-SiC wafers were implanted with 230 keV He+ ion at room temperature (RT) with fluences in the range 1.0 1015 2.0 1016 (0.040.8 dpa). The last single crystal 4H-SiC were implanted with 230 keV Si5+ ion at RT with fluences in the range 1.0 1015 1.0 1017 (0.044.0 dpa). Hardness versus maximum penetration depth curves for unimplanted 4H-SiC, and He/Si ion implanted 4H-SiC at different fluences. Nanoindentation was performed to investigate the hardening behavior of single crystals 4H-SiC under irradiation.