Inkjet 3D printing has potential in the additive manufacturing of electronic circuits and devices.However,inks that can be used for printing layers with T5%>300℃ or hardness>200 MPa have been rarely reported.Cy...Inkjet 3D printing has potential in the additive manufacturing of electronic circuits and devices.However,inks that can be used for printing layers with T5%>300℃ or hardness>200 MPa have been rarely reported.Cyanate ester(CE)polymers have excellent thermal stability,high strength,and low shrinkage compared to other common dielectric inks for inkjet 3D printing,but cannot be quickly shaped by ultraviolet(UV)irradiation or thermal treatment.Combining CEs with UV-curable monomers may be a possible way to accelerate crosslinking,but there are challenges from the adverse effects of the dilution of both monomers.In this study,dielectric inks with acrylate and cyanate moieties were developed.The low viscosity and surface tension of the CE precursor(Bisphenol E cyanate ester)were combined with photocurable acrylate diluent monomers and cross-linker to realize an ink suitable for inkjet 3D printing.An internal dual three-dimensional cross-linked network structure resin was prepared by a combination of photocuring and thermal curing with T5%up to 326.69℃,hardness up to 431.84 MPa,dielectric constant of 2.70 at 8 GHz,and shrinkage of 1.64%.The developed dielectric inks can be applied to the 3D printing of printed circuit boards and other electronic devices that require dielectric properties.展开更多
基金supported by the National Key Researchand Development Programof China(No.2022YFB4600101)the Strategic Priority Research Program of the Chinese Academy of Sciences(No.XDB 0470303)+2 种基金the National Natural Science Foundation of China(No.21974057)the Western Light Project of Chinese Academy of Sciences(No.xbzg-zdsy-202007)the Oasis Scholar of Shihezi University and the Central Government to Guide Local Technological Development(No.23ZYQA315).
文摘Inkjet 3D printing has potential in the additive manufacturing of electronic circuits and devices.However,inks that can be used for printing layers with T5%>300℃ or hardness>200 MPa have been rarely reported.Cyanate ester(CE)polymers have excellent thermal stability,high strength,and low shrinkage compared to other common dielectric inks for inkjet 3D printing,but cannot be quickly shaped by ultraviolet(UV)irradiation or thermal treatment.Combining CEs with UV-curable monomers may be a possible way to accelerate crosslinking,but there are challenges from the adverse effects of the dilution of both monomers.In this study,dielectric inks with acrylate and cyanate moieties were developed.The low viscosity and surface tension of the CE precursor(Bisphenol E cyanate ester)were combined with photocurable acrylate diluent monomers and cross-linker to realize an ink suitable for inkjet 3D printing.An internal dual three-dimensional cross-linked network structure resin was prepared by a combination of photocuring and thermal curing with T5%up to 326.69℃,hardness up to 431.84 MPa,dielectric constant of 2.70 at 8 GHz,and shrinkage of 1.64%.The developed dielectric inks can be applied to the 3D printing of printed circuit boards and other electronic devices that require dielectric properties.
