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Rational design of graphene/polymer composites with excellent electromagnetic interference shielding effectiveness and high thermal conductivity: a mini review 被引量:6
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作者 Xue Tan qilong yuan +4 位作者 Mengting Qiu Jinhong Yu Nan Jiang Cheng-Te Lin Wen Dai 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2022年第22期238-250,共13页
The integration and miniaturization of chips lead to inevitable overheating and increasing electromagnetic interference (EMI) problems, which threaten the performance, stability, and lifetime of electroniccomponents. ... The integration and miniaturization of chips lead to inevitable overheating and increasing electromagnetic interference (EMI) problems, which threaten the performance, stability, and lifetime of electroniccomponents. Therefore, it is important to improve the heat dissipation and EMI shielding performancein device packaging for the steady operation of electronic products. In recent years, due to its intrinsic superior thermal conductivity, proper electrical conductivity, light-weight, and structural adjustability,graphene has been widely used as high thermal and conductive fillers incorporated in the polymer matrix to improve the thermal conductivity and electrical conductivity of composites. This review concludesthe recent development of graphene/polymer composites by using graphene as fillers to improve thethermal conductivity and EMI shielding effectiveness (EMI SE). The structure of graphene embedded inthe composites varies from zero-dimension (0D), one-dimension (1D) to two-dimensions (2D). Moreover,highly thermally and electrically conductive fillers with different dimensions were also modified on thegraphene to improve the composite performance. Finally, this review also makes prospects for the development trend of graphene/polymer composites with high thermal conductivity and EMI SE in the future. 展开更多
关键词 Graphene/polymer composites Structural design Electromagnetic interference shielding Thermal conductivity
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Surfactant-assisted fabrication of graphene frameworks endowing epoxy composites with superior thermal conductivity 被引量:2
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作者 Fan Zhang Chen Ye +9 位作者 Wen Dai Le Lv qilong yuan Kuan W.A.Chee Ke Yang Nan Jiang Cheng-Te Lin Zhaolin Zhan Dan Dai He Li 《Chinese Chemical Letters》 SCIE CAS CSCD 2020年第1期244-248,共5页
With the rapid growth in electronic device performance,there has been an increasing demand for thermally conductive polymer composites to handle the thermal management issue,thus contributing to the great importance t... With the rapid growth in electronic device performance,there has been an increasing demand for thermally conductive polymer composites to handle the thermal management issue,thus contributing to the great importance to develop the graphene framework,which is evaluated as the most promising reinforcements for enhancing the thermal conductivity of polymer.Vacuum filtration is a common method to fabricate graphene framework,whereas,it is available to prepare a framework with centimeter-scale thickness by filtrating the graphene-water dispersion,due to the fact of sample cracking caused by the mismatch of surface tension between graphene and water.In this work,a surfactantassisted strategy was proposed by adjusting the surface tension of the water close to that of graphene first,then performing a conventional filtration process,to fabricate graphene framework.As a result,a thick graphene framework(thickness:3 cm)was successfully prepared,and after embedding into epoxy,the framework endows the composite(13.6 wt%)with a high in-plane thermal conductivities of12.4 W/mK,which is equivalent to≈64 times higher than that of neat epoxy.Our method is simple and compatible with the conventional filtration process,suggesting great potential for the mass-production of graphene framework to meet the practical application requirements. 展开更多
关键词 Graphene framework SURFACTANT Vacuum filtration Thermal conductivity Polymer composite
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A Spiral Graphene Framework Containing Highly Ordered Graphene Microtubes for Polymer Composites with Superior Through-Plane Thermal Conductivity 被引量:1
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作者 Jinrui Gong Xue Tan +11 位作者 qilong yuan Zhiduo Liu Junfeng Ying Le Lv Qingwei Yan Wubo Chu Chen Xue Jinhong Yu Kazuhito Nishimura Nan Jiang Cheng-Te Lin Wen Dai 《Chinese Journal of Chemistry》 SCIE CAS CSCD 2022年第3期329-336,共8页
As the power density of electronic devices increases,there has been an urgent demand to develop highly conductive polymer composites to address the accompanying thermal management issues.Due to the ultra-high intrinsi... As the power density of electronic devices increases,there has been an urgent demand to develop highly conductive polymer composites to address the accompanying thermal management issues.Due to the ultra-high intrinsic thermal conductivity,graphene is considered a very promising filler to improve the thermal conductivity of polymers.However,graphene-based polymer composites prepared by the conventional mixing method generally have limited thermal conductivity,even under high graphene loading,due to the failure to construct efficient heat transfer pathways in the polymer matrix.Here,a spiral graphene framework(SGF)containing continuous and highly ordered graphene microtubes was developed based on a modified CVD method.After embedding into the epoxy(EP)matrix,the graphene microtubes can act as efficient heat pathways,endowing the SGF/EP composites with a high through-plane thermal conductivity of 1.35 W·m^(-1)·K^(-1) at an ultralow graphene loading of 0.86 wt%.This result gives a thermal conductivity enhancement per 1 wt%filler loading of 710%,significantly outperforming various graphene structures as fillers.In addition,we demonstrated the practical application of the SGF/EP composite as a thermal interface material for efficient thermal man-agement of the light-emitting diode(LED). 展开更多
关键词 GRAPHENE Chemical vapor deposition Polymer Thermal conductivity Thermal management material
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Strategy for robot motion and path planning in robot taping
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作者 qilong yuan I-Ming CHEN +2 位作者 Teguh Santoso LEMBONO Simon Nelson LANDEN Victor MALMGREN 《Frontiers of Mechanical Engineering》 SCIE CSCD 2016年第2期195-203,共9页
Covering objects with masking tapes is a common process for surface protection in processes like spray painting, plasma spraying, shot peening, etc. Manual taping is tedious and takes a lot of effort of the workers. T... Covering objects with masking tapes is a common process for surface protection in processes like spray painting, plasma spraying, shot peening, etc. Manual taping is tedious and takes a lot of effort of the workers. The taping process is a special process which requires correct surface covering strategy and proper attachment of the masking tape for an efficient surface protection. We have introduced an automatic robot taping system consist- ing of a robot manipulator, a rotating platform, a 3D scanner and specially designed taping end-effectors. This paper mainly talks about the surface covering strategies for different classes of geometries. The methods and corre- sponding taping tools are introduced for taping of following classes of surfaces: Cylindrical/extended sur- faces, freeform surfaces with no grooves, surfaces with grooves, and rotational symmetrical surfaces. A collision avoidance algorithm is introduced for the robot taping manipulation. With further improvements on segmenting surfaces of taping parts and tape cutting mechanisms, such taping solution with the taping tool and the taping methodology can be combined as a very useful and practical taping package to assist humans in this tedious and time costly work. 展开更多
关键词 robot taping path planning robot manipula-tion 3D scanning
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