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Fine Characterization and Analysis of Drying Strain of the ELM Board via DIC Technology
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作者 Yuanchu Liu Xiaodong Zhu +5 位作者 Zhengmin Jin Yingying Liu qingjian wei Bonan Liang Yingchun Cai Jingyao Zhao 《Journal of Renewable Materials》 SCIE EI 2023年第2期567-580,共14页
In this paper,the occurrence and development mechanism of strain on the cross-section during the wood drying is explored.Therefore,strain regularity on the cross-section of 50 mm thickness elm(Ulmus rubra)board at the... In this paper,the occurrence and development mechanism of strain on the cross-section during the wood drying is explored.Therefore,strain regularity on the cross-section of 50 mm thickness elm(Ulmus rubra)board at the temperature of 40℃and 80℃is detected via digital image correlation technology.Hence,the difference between tangential and radial strain at surface and core layers was denoted.The results showed that strain distribution in the width direction of the board is uneven.Moreover,a large drying shrinkage strain occurs at the near-core layer,while the maximum strain difference reaches 4.08%.Hence,the surface of the board is cracked along the thickness direction.The radial strain of the board is higher than the tangential strain in the early stage of drying,while these strains are reversed in the later stage of drying.The temperature is related to the difference between the tangential and radial strains of the elm board.These differences at the core layer are larger than those of the surface layer.The conducted research results provide a theoretical basis for process optimization. 展开更多
关键词 Digital image correlation technology drying strain fine characterization moisture content distribution
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