A data identifier(DID)is an essential tag or label in all kinds of databases—particularly those related to integrated computational materials engineering(ICME),inheritable integrated intelligent manufacturing(I3M),an...A data identifier(DID)is an essential tag or label in all kinds of databases—particularly those related to integrated computational materials engineering(ICME),inheritable integrated intelligent manufacturing(I3M),and the Industrial Internet ofThings.With the guidance and quick acceleration of the developme nt of advanced materials,as envisioned by official documents worldwide,more investigations are required to construct relative numerical standards for material informatics.This work proposes a universal DID format consisting of a set of build chains,which aligns with the classical form of identifier in both international and national standards,such as ISO/IEC 29168-1:2000,GB/T 27766-2011,GA/T 543.2-2011,GM/T 0006-2012,GJB 7365-2011,SL 325-2014,SL 607-201&WS 363.2-2011,and QX/T 39-2005.Each build chain is made up of capital letters and numbers,with no symbols.Moreover,the total length of each build chain is not restricted,which follows the formation of the Universal Coded Character Set in the international standard of ISO/IEC 10646.Based on these rules,the proposed DID is flexible and convenient for extendi ng and sharing in and between various cloud-based platforms.Accordingly,classical two-dimensional(2D)codes,including the Hanxin Code,Lots Perception Matrix(LP)Code,Quick Response(Q.R)code,Grid Matrix(GM)code,and Data Matrix(DM)Code,can be constructed and precisely recognized and/or decoded by either smart phones or specific machines.By utilizing these 2D codes as the fingerprints of a set of data linked with cloud-based platforms,progress and updates in the composition-processing-structure-property-performance workflow process can be tracked spontaneously,paving a path to accelerate the discovery and manufacture of advanced materials and enhance research productivity,performance,and collaboration.展开更多
基金This work was financially supported by the National Key Research and Development Program of China(2018YFB0703801,2018YFB0703802,2016YFB0701303,and 2016YFB0701304)CRRC Tangshan Co.,Ltd.(201750463031).Special thanks to Professor Hong Wang at Shanghai Jiao Tong University for the fruitful discussions and the constructive suggestions/comments.
文摘A data identifier(DID)is an essential tag or label in all kinds of databases—particularly those related to integrated computational materials engineering(ICME),inheritable integrated intelligent manufacturing(I3M),and the Industrial Internet ofThings.With the guidance and quick acceleration of the developme nt of advanced materials,as envisioned by official documents worldwide,more investigations are required to construct relative numerical standards for material informatics.This work proposes a universal DID format consisting of a set of build chains,which aligns with the classical form of identifier in both international and national standards,such as ISO/IEC 29168-1:2000,GB/T 27766-2011,GA/T 543.2-2011,GM/T 0006-2012,GJB 7365-2011,SL 325-2014,SL 607-201&WS 363.2-2011,and QX/T 39-2005.Each build chain is made up of capital letters and numbers,with no symbols.Moreover,the total length of each build chain is not restricted,which follows the formation of the Universal Coded Character Set in the international standard of ISO/IEC 10646.Based on these rules,the proposed DID is flexible and convenient for extendi ng and sharing in and between various cloud-based platforms.Accordingly,classical two-dimensional(2D)codes,including the Hanxin Code,Lots Perception Matrix(LP)Code,Quick Response(Q.R)code,Grid Matrix(GM)code,and Data Matrix(DM)Code,can be constructed and precisely recognized and/or decoded by either smart phones or specific machines.By utilizing these 2D codes as the fingerprints of a set of data linked with cloud-based platforms,progress and updates in the composition-processing-structure-property-performance workflow process can be tracked spontaneously,paving a path to accelerate the discovery and manufacture of advanced materials and enhance research productivity,performance,and collaboration.
