The influence of mechanical activation on the leaching behaviour of scheelite was studied by means of fine grinding in an attritor and subsequently HCl leaching in presence of PO_4^(3-). Results showed that after fine...The influence of mechanical activation on the leaching behaviour of scheelite was studied by means of fine grinding in an attritor and subsequently HCl leaching in presence of PO_4^(3-). Results showed that after fine grinding in the attritor,the reaction rate of scheelite with HCl-Na_3PO_4 solution was remarkably increased,the extraction of W increased from about 8 to 99%.The IR spectra and X-ray diffraction analysis indicated that in addition to an enlargement of surface area the fine grinding action had made also changes of fine struc- ture and reactivity of solid surface,hence the leaching process of scheelite can be carried out under mild leaching conditions.展开更多
由电磁振动或机械振动的立式电极,其传质效果是静止电极的8倍。电极的往复运动可使细颗粒枝晶铜粉自阴极上连续分离下来,无需任何细磨及分级作业等后续处理,即可得到平均粒度为2~10μm的铜粉。影响过程的主要因素为振动频率(10~80Hz)...由电磁振动或机械振动的立式电极,其传质效果是静止电极的8倍。电极的往复运动可使细颗粒枝晶铜粉自阴极上连续分离下来,无需任何细磨及分级作业等后续处理,即可得到平均粒度为2~10μm的铜粉。影响过程的主要因素为振动频率(10~80Hz)及振幅(0.3~100mm)、阴极材料、阴极电位和硫酸溶液电解质的组成。在本文中亦讨论了生产厚膜工艺(thick film technology)所需特细铜粉的可能性。展开更多
文摘The influence of mechanical activation on the leaching behaviour of scheelite was studied by means of fine grinding in an attritor and subsequently HCl leaching in presence of PO_4^(3-). Results showed that after fine grinding in the attritor,the reaction rate of scheelite with HCl-Na_3PO_4 solution was remarkably increased,the extraction of W increased from about 8 to 99%.The IR spectra and X-ray diffraction analysis indicated that in addition to an enlargement of surface area the fine grinding action had made also changes of fine struc- ture and reactivity of solid surface,hence the leaching process of scheelite can be carried out under mild leaching conditions.
文摘由电磁振动或机械振动的立式电极,其传质效果是静止电极的8倍。电极的往复运动可使细颗粒枝晶铜粉自阴极上连续分离下来,无需任何细磨及分级作业等后续处理,即可得到平均粒度为2~10μm的铜粉。影响过程的主要因素为振动频率(10~80Hz)及振幅(0.3~100mm)、阴极材料、阴极电位和硫酸溶液电解质的组成。在本文中亦讨论了生产厚膜工艺(thick film technology)所需特细铜粉的可能性。