Microstructure and crystallographic characteristics of nanocrystalline copper prepared from acetate solutions by electrodeposition technique

Methane sulphonic acid is an alternative electrolyte for conventional sulphuric acid for copper deposition.Theelectrodeposition of copper from eco-friendly acetate-based electrolytes consisting of copper acetate,sodium acetate and methanesulphonic acid was dealt.Thamine hydrochloride(THC),saccharin and4-amino-3-hydroxynaphthalene1-suphonic acid were used asadditives in depositing electrolytes.The cathode current efficiency was calculated using the Faraday’s law.Metal distrbution ratio ofthe solutions was determined using Haring?Blum cell.These additives impact the surface morphology of deposited copper films bydowngrading,the grain size was analyzed by scanning electron microscopy(SEM)and X-ray diffiraction technique.XRD patternacquired for electrodeposited copper film shows polycrystalline and face centered cubic structure(FCC).The crystal size of thecopper film was calculated using the Debye?Scherrer’s equation.The crystal size revealed that deposits produced from additivecontaining electrolytes exhibited the lowest grain size.Texture coefficient analysis studies revealed that all copper film deposits arepolycrystalline and the crystals are preferentially oriented and parallel to the surface.A uniform and pin-hole free surfacemorphology and grain refining were brought about by the additives.