期刊文献+
共找到1篇文章
< 1 >
每页显示 20 50 100
Electrochemical Study of Diffusion Bonded Joints between Micro-duplex Stainless Steel and Ti6A14V Alloy 被引量:1
1
作者 Shaily M.bhola Sukumar Kundu +2 位作者 rahul bhola Brajendra Mishra Subrata Chatterjee 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2014年第2期163-171,共9页
In the present study, corrosion behavior of diffusion bonded joints formed between micro-duplex stainless steel (MDSS) and Ti6AI4V alloy (TiA) (at 900 ~C for 60 min under 4 MPa uniaxial pressure in vacuum) was i... In the present study, corrosion behavior of diffusion bonded joints formed between micro-duplex stainless steel (MDSS) and Ti6AI4V alloy (TiA) (at 900 ~C for 60 min under 4 MPa uniaxial pressure in vacuum) was investigated in 1 mol/L HCI and 1 mol/L NaOH solutions using various electrochemical measurements such as open circuit potential (OCP), electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization (PD). For comparison, corrosion behavior of base metals (MDSS and TiA) was also evaluated. Bonded joint was characterized by light optical microscopy and scanning electron microscopy using backscattered electron mode. The layer wise σ phase and λ + FeTi phase mixture has been observed at the bond interface and the bond tensile strength and shear strength were - 556.4 MPa and -420.2 MPa, respectively. 展开更多
关键词 Diffusion bonding Micro-duplex stainless steel Titanium ahoy Corrosion EIS
原文传递
上一页 1 下一页 到第
使用帮助 返回顶部