Recently, we developed a nonbuckling interconnect design that provides an effective approach to simultaneously achieving high elastic stretchability, easiness for encapsulation, and high electric performance for stret...Recently, we developed a nonbuckling interconnect design that provides an effective approach to simultaneously achieving high elastic stretchability, easiness for encapsulation, and high electric performance for stretchable electronics. This paper aims to systematically study its mechanical and electric behaviors, including comparisons of the nonbuckling and buckling interconnect designs on stretchability, effects of the thickness on electric performance, and modeling and experimental investigations on the finite deformation mechanics. It is found that the results on stretchability depend on the layouts. Long straight segments and small arc radii for nonbuckling interconnects yield an enhancement of stretchability, which is much better than that of buckling designs. On the other hand, shorter straight segments or thicker interconnects are better to lower the resistances of interconnects.Therefore, optimization of the designs needs to balance the requirements of both the mechanical and electric performances. The finite deformation of interconnects during stretching is analyzed. The established analytic model is well validated by both the finite element modeling and experimental investigations. This work is key for providing the design guidelines for nonbucklingbased stretchable electronics.展开更多
Transfer printing is an emerging assembly technique for flexible and stretchable electronics.Although a variety of transfer printing methods have been developed,transferring patterns with nanometer resolution remains ...Transfer printing is an emerging assembly technique for flexible and stretchable electronics.Although a variety of transfer printing methods have been developed,transferring patterns with nanometer resolution remains challenging.We report a sacrificial layer-assisted nanoscale transfer printing method.A sacrificial layer is deposited on a donor substrate,and ink is prepared on and transferred with the sacrificial layer.Introducing the sacrificial layer into the transfer printing process eliminates the effect of the contact area on the energy release rate(ERR)and ensures that the ERR for the stamp/ink-sacrificial layer interface is greater than that for the sacrificial layer/donor interface even at a slow peel speed(5mm s−1).Hence,large-area nanoscale patterns can be successfully transferred with a yield of 100%,such as Au nanoline arrays(100 nm thick,4 mm long and 47 nm wide)fabricated by photolithography techniques and PZT nanowires(10mm long and 63nm wide)fabricated by electrohydrodynamic jet printing,using only a blank stamp and without the assistance of any interfacial chemistries.Moreover,the presence of the sacrificial layer also enables the ink to move close to the mechanical neutral plane of the multilayer peel-off sheet,remarkably decreasing the bending stress and obviating cracks or fractures in the ink during transfer printing.展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.11572323,11772331,11302038,51365013,and 11732004)the Chinese Academy of Sciences via the "Hundred Talent Program"+8 种基金the Strategic Priority Research Program of the Chinese Academy of Sciences(Grant No.XDB22040501)the State Key Laboratory of Structural Analysis for Industrial Equipment,Dalian University of Technology(Grant No.GZ1603)the State Key Laboratory of Digital Manufacturing Equipment and Technology,Huazhong University of Science and Technology(Grant No.DMETKF2017008)the Young Elite Scientists Sponsorship Program by CAST(Grant No.2015QNRC001)the Opening Fund of State Key Laboratory of Nonlinear Mechanicsthe Personnel Training Plan of Tianjin City in China for the Key Young and Middle-Aged Innovation Talentsthe National Key Research and Development Plan(Grant Nos.2016YFB0201600,2016YFB0201601,2017YFB0202800,and 2017YFB0202802)the Program for Changjiang Scholars,Innovative Research Team in University(PCSIRT)the 111 Project(Grant No.B14013)
文摘Recently, we developed a nonbuckling interconnect design that provides an effective approach to simultaneously achieving high elastic stretchability, easiness for encapsulation, and high electric performance for stretchable electronics. This paper aims to systematically study its mechanical and electric behaviors, including comparisons of the nonbuckling and buckling interconnect designs on stretchability, effects of the thickness on electric performance, and modeling and experimental investigations on the finite deformation mechanics. It is found that the results on stretchability depend on the layouts. Long straight segments and small arc radii for nonbuckling interconnects yield an enhancement of stretchability, which is much better than that of buckling designs. On the other hand, shorter straight segments or thicker interconnects are better to lower the resistances of interconnects.Therefore, optimization of the designs needs to balance the requirements of both the mechanical and electric performances. The finite deformation of interconnects during stretching is analyzed. The established analytic model is well validated by both the finite element modeling and experimental investigations. This work is key for providing the design guidelines for nonbucklingbased stretchable electronics.
基金supported by the National Natural Science Foundation of China(Grant Nos.11821202,12002073,and 12002077)the National Key Research and Development Plan(Grant No.2020YFB1709400)+3 种基金Liaoning Revitalization Talents Program(Grant Nos.XLYC2001003 and XLYC1907119)Dalian Talent Innovation Program(Grant No.2020RQ099)the Fundamental Research Funds for the Central Universities(Grant Nos.DUT20RC(3)020,DUT21RC(3)076,and DUT22QN238)111 Project(Grant No.B14013).
基金This work was supported by the National Natural Science Foundation of China(51875083,51621064)Y.L.acknowledges the support from the QMUL SBCS start-up and the Royal Society Research Grant(RGS\R1\201071).
文摘Transfer printing is an emerging assembly technique for flexible and stretchable electronics.Although a variety of transfer printing methods have been developed,transferring patterns with nanometer resolution remains challenging.We report a sacrificial layer-assisted nanoscale transfer printing method.A sacrificial layer is deposited on a donor substrate,and ink is prepared on and transferred with the sacrificial layer.Introducing the sacrificial layer into the transfer printing process eliminates the effect of the contact area on the energy release rate(ERR)and ensures that the ERR for the stamp/ink-sacrificial layer interface is greater than that for the sacrificial layer/donor interface even at a slow peel speed(5mm s−1).Hence,large-area nanoscale patterns can be successfully transferred with a yield of 100%,such as Au nanoline arrays(100 nm thick,4 mm long and 47 nm wide)fabricated by photolithography techniques and PZT nanowires(10mm long and 63nm wide)fabricated by electrohydrodynamic jet printing,using only a blank stamp and without the assistance of any interfacial chemistries.Moreover,the presence of the sacrificial layer also enables the ink to move close to the mechanical neutral plane of the multilayer peel-off sheet,remarkably decreasing the bending stress and obviating cracks or fractures in the ink during transfer printing.
