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Suppression of discontinuous precipitation and strength improvement by Sc doping in Cu-6 wt%Ag alloys
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作者 Bailing An Rongmei Niu +8 位作者 Yan Xin William LStarch Zhaolong Xiang Yifeng Su robert e.goddard Jun Lu Theo M.Siegrist Engang Wang Ke Han 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2023年第4期80-96,共17页
In low-Ag Cu matrix alloys,the presence of coarse discontinuous precipitates may limit strength.We demonstrated that discontinuous precipitation was suppressed,and continuous precipitation was en-hanced by the doping ... In low-Ag Cu matrix alloys,the presence of coarse discontinuous precipitates may limit strength.We demonstrated that discontinuous precipitation was suppressed,and continuous precipitation was en-hanced by the doping of Cu-6 wt%Ag with Sc.A high-volume fraction of continuous precipitates,which nucleated on{111}planes,led to a 55 MPa increase in strength,with only a slight decrease in electri-cal conductivity.The addition of Sc inhibited the nucleation of discontinuous precipitates by causing the Sc and the Ag to co-segregate onto grain boundaries,thus forming a thin intermetallic compound layer between grains.After deformation,both discontinuous and continuous precipitates were drawn into Ag fibers.The combination of deformation strain and doping caused an increase in density and a decrease in the diameter of Ag fibers,resulting in about 205 MPa increase in doped samples when the deformation strain reached 4.9.The thinner,denser Ag fibers in the doped samples also caused higher electron scatter-ing at interfaces,leading to electrical conductivity that was 11%IACS lower than in non-doped samples.For reference,100%IACS(International Annealed Copper Standard)is equivalent to 1.7241μΩcm. 展开更多
关键词 Sc doping Grain boundary segregation Precipitation STRENGTH Electrical conductivity Plastic deformation
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