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Microstructure and properties of an Al–Ti–Cu–Si brazing alloy for SiC–metal joining
被引量:
1
1
作者
Chun-duo Dai
rui-na ma
+2 位作者
Wei Wang
Xiao-ming Cao
Yan Yu
《International Journal of Minerals,Metallurgy and Materials》
SCIE
EI
CAS
CSCD
2017年第5期557-565,共9页
An Al–Ti–Cu–Si solid–liquid dual-phase alloy that exhibits good wettability and appropriate interfacial reaction with SiC at 500–600°C was designed for SiC–metal joining. The microstructure, phases, differe...
An Al–Ti–Cu–Si solid–liquid dual-phase alloy that exhibits good wettability and appropriate interfacial reaction with SiC at 500–600°C was designed for SiC–metal joining. The microstructure, phases, differential thermal curves, and high-temperature wetting behavior of the alloy were analyzed using scanning electron microscopy, X-ray diffraction analysis, differential scanning calorimetry, and the sessile drop method. The experimental results show that the 76.5Al–8.5Ti–5Cu–10Si alloy is mainly composed of Al–Al2Cu and Al–Si hypoeutectic low-melting-point microstructures (493–586°C) and the high-melting-point intermetallic compound AlTiSi (840°C). The contact angle, determined by high-temperature wetting experiments, is approximately 54°. Furthermore, the wetting interface is smooth and contains no obvious defects. Metallurgical bonding at the interface is attributable to the reaction between Al and Si in the alloy and ceramic, respectively. The formation of the brittle Al4C3phase at the interface is suppressed by the addition of 10wt% Si to the alloy. © 2017, University of Science and Technology Beijing and Springer-Verlag Berlin Heidelberg.
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关键词
ALLOYS
Aluminum
copper
alloys
Ceramic
materials
Differential
scanning
calorimetry
INTERMETALLICS
Joining
Melting
point
Metals
Microstructure
Scanning
electron
microscopy
Silicon
Silicon
alloys
Silicon
carbide
Soldering
alloys
Titanium
alloys
WETTING
X
ray
diffraction
analysis
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题名
Microstructure and properties of an Al–Ti–Cu–Si brazing alloy for SiC–metal joining
被引量:
1
1
作者
Chun-duo Dai
rui-na ma
Wei Wang
Xiao-ming Cao
Yan Yu
机构
School of Materials Science and Engineering
Commercial Aircraft Corporation of China
出处
《International Journal of Minerals,Metallurgy and Materials》
SCIE
EI
CAS
CSCD
2017年第5期557-565,共9页
基金
financially supported by the High-Tech Research and Development Program of China(No.SS2013AA031305)
the Key Technologies R&D Program of Tianjin(No.12ZCDGGX49100)
文摘
An Al–Ti–Cu–Si solid–liquid dual-phase alloy that exhibits good wettability and appropriate interfacial reaction with SiC at 500–600°C was designed for SiC–metal joining. The microstructure, phases, differential thermal curves, and high-temperature wetting behavior of the alloy were analyzed using scanning electron microscopy, X-ray diffraction analysis, differential scanning calorimetry, and the sessile drop method. The experimental results show that the 76.5Al–8.5Ti–5Cu–10Si alloy is mainly composed of Al–Al2Cu and Al–Si hypoeutectic low-melting-point microstructures (493–586°C) and the high-melting-point intermetallic compound AlTiSi (840°C). The contact angle, determined by high-temperature wetting experiments, is approximately 54°. Furthermore, the wetting interface is smooth and contains no obvious defects. Metallurgical bonding at the interface is attributable to the reaction between Al and Si in the alloy and ceramic, respectively. The formation of the brittle Al4C3phase at the interface is suppressed by the addition of 10wt% Si to the alloy. © 2017, University of Science and Technology Beijing and Springer-Verlag Berlin Heidelberg.
关键词
ALLOYS
Aluminum
copper
alloys
Ceramic
materials
Differential
scanning
calorimetry
INTERMETALLICS
Joining
Melting
point
Metals
Microstructure
Scanning
electron
microscopy
Silicon
Silicon
alloys
Silicon
carbide
Soldering
alloys
Titanium
alloys
WETTING
X
ray
diffraction
analysis
Keywords
Alloys
Aluminum copper alloys
Ceramic materials
Differential scanning calorimetry
Intermetallics
Joining
Melting point
Metals
Microstructure
Scanning electron microscopy
Silicon
Silicon alloys
Silicon carbide
Soldering alloys
Titanium alloys
Wetting
X ray diffraction analysis
分类号
TG454 [金属学及工艺—焊接]
TQ174.6 [化学工程—陶瓷工业]
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作者
出处
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被引量
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1
Microstructure and properties of an Al–Ti–Cu–Si brazing alloy for SiC–metal joining
Chun-duo Dai
rui-na ma
Wei Wang
Xiao-ming Cao
Yan Yu
《International Journal of Minerals,Metallurgy and Materials》
SCIE
EI
CAS
CSCD
2017
1
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