We describe briefly here the recent R&D activities in the optical subassembly packaging technologies at the Hong Kong Applied Science and Technology Research Institute (ASTRI). We have designed, developed and prot...We describe briefly here the recent R&D activities in the optical subassembly packaging technologies at the Hong Kong Applied Science and Technology Research Institute (ASTRI). We have designed, developed and prototyped multiple of low-cost high performance packages for serial and parallel transmitters and receivers, in particular, the novel chip-in-plastic (CiP) package designed for 10G serial transmission for data communications.展开更多
文摘We describe briefly here the recent R&D activities in the optical subassembly packaging technologies at the Hong Kong Applied Science and Technology Research Institute (ASTRI). We have designed, developed and prototyped multiple of low-cost high performance packages for serial and parallel transmitters and receivers, in particular, the novel chip-in-plastic (CiP) package designed for 10G serial transmission for data communications.
