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Metamorphic InGaAs Quantum Well Laser Diodes at 1.5μm on GaAs Grown by Molecular Beam Epitaxy 被引量:1
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作者 王海莉 吴东海 +8 位作者 吴兵朋 倪海桥 黄社松 熊永华 王鹏飞 韩勤 牛智川 I.Tangring s.m.wang 《Chinese Physics Letters》 SCIE CAS CSCD 2009年第1期142-144,共3页
We report a 1.5-μm InGaAs/GaAs quantum well laser diode grown by molecular beam epitaxy on InGaAs metamorphic buffers. At 150K, for a 1500×10μm^2 ridge waveguide laser, the lazing wavelength is centred at 1.508... We report a 1.5-μm InGaAs/GaAs quantum well laser diode grown by molecular beam epitaxy on InGaAs metamorphic buffers. At 150K, for a 1500×10μm^2 ridge waveguide laser, the lazing wavelength is centred at 1.508 μm and the threshold current density is 667 A/cm^2 under pulsed operation. The pulsed lasers can operate up to 286 K. 展开更多
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高性能高应变InGaAs量子阱脊型波导半导体激光器
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作者 曲轶 J.X.Zhang +6 位作者 A.Uddin s.m.wang M.Sadeghi A.Larsson 薄报学 刘国军 姜会林 《中国科学(E辑)》 CSCD 北大核心 2006年第3期341-346,共6页
介绍了利用分子束外延系统生长高应变InGaAs量子阱半导体激光器材料,采用脉冲阳极氧化技术制作脊型波导半导体激光器.4μm条宽脊型波导半导体激光器在室温下单面连续输出功率达到50mW.腔长600μm时,器件阈值电流密度为300A/cm2.在100mA... 介绍了利用分子束外延系统生长高应变InGaAs量子阱半导体激光器材料,采用脉冲阳极氧化技术制作脊型波导半导体激光器.4μm条宽脊型波导半导体激光器在室温下单面连续输出功率达到50mW.腔长600μm时,器件阈值电流密度为300A/cm2.在100mA电流下,激光器的峰值波长为1.19μm,激光器的最大斜率效率为0.45W/A.在20℃至100℃温度下,激光器的特征温度为129K. 展开更多
关键词 高应变 InGaAs量子阱 脊型波导激光器
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Unique microstructure and thermal insulation property of a novel waste-utilized foam ceramic 被引量:5
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作者 F.H.Kuang s.m.wang +5 位作者 C.Gao H.B.Zhang R.K.Ren J.L.Ren J.Tong Y.M.Liu 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2020年第13期175-179,共5页
A characteristic CaO-Al2O3-SiO2 based foam ceramic was prepared by melt-foaming with solid wastes as main raw materials.The similarity to sandwich hole wall microstructure of this novel thermal insulating material was... A characteristic CaO-Al2O3-SiO2 based foam ceramic was prepared by melt-foaming with solid wastes as main raw materials.The similarity to sandwich hole wall microstructure of this novel thermal insulating material was presented and the relationships between this unique microstructure and porosity,density,thermal conductivity and strength were discussed.Comparing the measured and theoretical values with that of the traditional foam ceramic,it can be found that,for the matching of fine skeleton with hole wall,this original sandwich structure can reduce thermal conductivity and increase flexural strength effectively. 展开更多
关键词 Foam ceramic DENSITY POROSITY STRENGTH Thermal conductivity Sandwich structure
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Stresses State and Mechanical Behaviors of the Green Body During Die Compaction and Ejection Process 被引量:1
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作者 s.m.wang Y.Wang +2 位作者 Y.X.Wang F.P.Liu J.Cao 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2020年第4期605-614,共10页
Finite element simulations for metal powder compaction of a clutch plate were performed to examine the stresses during compaction,unloading,and ejection.To describe the mechanical behavior of compacted green body,a mo... Finite element simulations for metal powder compaction of a clutch plate were performed to examine the stresses during compaction,unloading,and ejection.To describe the mechanical behavior of compacted green body,a modified densitydependent Drucker-Prager Cap model was utilized to predict the stress and density distribution of the compacted clutch plate during loading and ejection stages.The results indicate that maximum tensile principal stress was a main driving force for the tensile crack initiation during ejection stage,and shear stress may be another driving force in both compaction and ejection stages for shear crack initiation.There were peak value of the stresses during ejection stage,and the stresses are in compressive state only during compaction stage.Therefore,the tensile crack initiation is not possible during compaction except shear crack.Hoop stress in the clutch plate is of less contribution to the crack initiation during compaction,unloading and ejection.Study of criteria of the crack initiation and fracture is necessary in order to obtain uniform density and crackfree components in the manufacturing of metal powder compaction. 展开更多
关键词 POWDER COMPACTION FINITE element simulation Stress HISTORY CAP model Green body
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