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锂离子电池结合棋盘拓扑分流结构的浸没冷却热管理研究 被引量:4
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作者 刘倩 石千磊 +3 位作者 李凯璇 徐超 廖志荣 巨星 《发电技术》 2021年第2期218-229,共12页
针对动力电池热管理的问题,对18650圆柱型锂离子电池阵列的新型液冷结构及其冷却效果展开研究。提出棋盘拓扑分流结构的浸没式冷却方法,结合锂离子电池自身形状和阵列排布的特点,基于电池阵列本体形成一种简单合理的浸没式冷却拓扑结构... 针对动力电池热管理的问题,对18650圆柱型锂离子电池阵列的新型液冷结构及其冷却效果展开研究。提出棋盘拓扑分流结构的浸没式冷却方法,结合锂离子电池自身形状和阵列排布的特点,基于电池阵列本体形成一种简单合理的浸没式冷却拓扑结构。在此新型冷却结构的设计下,进一步建立电池阵列的单体模型和模组模型,通过数值模拟方法对单体模型和模组模型在各个时刻的温度分布情况进行分析,验证了以单体模型代替模组模型的可行性。在确保单体模型计算准确性的基础上,对冷却液流道的出入口布置进行数值模拟,结果表明:流道出入口同侧布置与异侧布置具有几乎相同的出入口压降,但流道出入口同侧布置的冷却效果优于异侧布置,且随着电池生热量的增大和生热时间的增加,同侧出入口布置的优势更加明显。 展开更多
关键词 锂离子电池 热管理 歧管 浸没冷却 数值模拟
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An investigation on topologies of hybrid manifold,impinging-jet nozzle and micro-pin-fin heat sinks
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作者 shi qianlei YAO XiaoLe +3 位作者 LIU Qian QIN Le JU Xing XU Chao 《Science China(Technological Sciences)》 SCIE EI CAS CSCD 2024年第4期1061-1076,共16页
The hybrid manifold micro-pin-fin(MMPF)heat sink combined nozzle jets is an option for large-scale integrated circuits(LSI).The demond for uniform and ultra-high heat flux removal by MMPF heat sink has not been adequa... The hybrid manifold micro-pin-fin(MMPF)heat sink combined nozzle jets is an option for large-scale integrated circuits(LSI).The demond for uniform and ultra-high heat flux removal by MMPF heat sink has not been adequately investigated.This work aims to solve the problem of fluid organization.The proposed basic tiling topologies,including square,regular hexagon,30°rhombus,and 60°rhombus topologies,provide different organized fluid flows and heat transfer patterns.The present study focuses on comparing these topologies according to independent porous medium parameters,such as nozzle pore size D_(Z),flow pore size D_(X,Y),and porosityε.The results show that the square topology achieves the smallest total thermal resistance R_(tot)value of0.0975×10^(-4)K m^2/W,while the hexagon topology achieved the highest value of COP/?T,which was 2033.9 K^(-1).According to the sensitivity analysis results,the optimal total thermal resistance can be obtained by balancing the influences of nozzle pore size,flow pore size,and porosity.The optimal pressure drop can be obtained by maximizing the porosity. 展开更多
关键词 heat sink ultra-high heat flux MANIFOLD micro-pin-fin impinging-jet topology
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基于棋盘型高拓扑热沉结构不同喷嘴射流分布结构的数值研究 被引量:2
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作者 石千磊 刘倩 +2 位作者 李凯璇 巨星 徐超 《中国科学:技术科学》 EI CSCD 北大核心 2021年第6期699-710,共12页
电子或电力电子芯片的高密度热流换热问题是制约芯片技术的核心问题之一.本文针对棋盘型喷嘴射流/歧管/微针翅复合结构拓扑形态设计和几何构造参数影响关系进行数值模拟研究.建立喷嘴阵列在正方形、正六边形和菱形三种拓扑结构下换热单... 电子或电力电子芯片的高密度热流换热问题是制约芯片技术的核心问题之一.本文针对棋盘型喷嘴射流/歧管/微针翅复合结构拓扑形态设计和几何构造参数影响关系进行数值模拟研究.建立喷嘴阵列在正方形、正六边形和菱形三种拓扑结构下换热单元的计算模型,分析各拓扑结构不同参数尺度的流动换热性能.计算结果表明,当射流孔和微针翅的直径分别为50和100μm时,正六边形喷嘴阵列拓扑下复合换热结构压降较小,但换热效果也受到局限;菱形喷嘴阵列拓扑虽然具有最高的局部对流换热系数(>150000 W/(Km^(2))),但微针翅表面的换热系数较低,温度分布的不均匀程度较大;正方形喷嘴阵列拓扑下热沉的性能具有显著优势,压降仅3150 Pa时,总热阻低至0.099×10^(-4)Km^(2)/W.该复合热沉结构具有高拓扑性,易于与不同形状大小的芯片相结合,在进一步降低结构尺度和接触热阻后,将在高热流密度芯片冷却领域展示出更好的应用潜力. 展开更多
关键词 高热流密度 复合热沉 微针翅 歧管 喷嘴射流
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An investigation on application potentiality of microstructure heat sinks with different flow topological morphology 被引量:4
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作者 YAO XiaoLe shi qianlei +3 位作者 LIU Qian QIN Le JU Xing XU Chao 《Science China(Technological Sciences)》 SCIE EI CAS CSCD 2022年第12期2895-2909,共15页
Microstructure heat sinks have great potential for high heat flux cooling.In this paper,we compared microchannel(MC),micro-pin-fin(MPF),manifold microchannel(MMC),and manifold micro-pin-fin(MMPF)heat sinks to figure o... Microstructure heat sinks have great potential for high heat flux cooling.In this paper,we compared microchannel(MC),micro-pin-fin(MPF),manifold microchannel(MMC),and manifold micro-pin-fin(MMPF)heat sinks to figure out the pros and cons.Fluid flow and manifold unit models are used to study thermal and hydrodynamic performance.The heat sinks with different channel/fin sizes,manifold numbers,and porosities are discussed according to the pressure drop,temperature,thermal resistance,and coefficient of performance.Results show that MMC and MMPF heat sinks are superior to MC and MPF heat sinks,and there are also differences between MMC and MMPF heat sinks.Typically,the MMPF heat sink has lower maximum temperature,temperature non-uniformity,and total thermal resistance R_(tot).In contrast,the MMC heat sink has a lower pressure drop and higher COP.For the MMPF heat sink,at the nozzle width of 6.75μm and the MPF width of 70.71μm(porosity=0.167),it achieves the lowest total thermal resistance of R_(tot)=2.97×10^(-6)K m^(2)/W.Under 10^(3)W/cm^(2)heat flux,the maximum surface temperature rise is 29.74 K,and the maximum temperature difference of the heating surface is 3.15 K.This research initially provides a clear reference on the selection of single-phase cooling microstructures for ultra-high heat flux dissipation. 展开更多
关键词 heat sink topology MANIFOLD MICROCHANNEL micro-pin-fin high heat flux
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