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A non-destructive channel stress characterization for gate-allaround nanosheet transistors by confocal Raman methodology
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作者 Ziqiang Huang Tao Liu +8 位作者 Jingwen Yang Xin Sun Kun Chen Dawei Wang Hailong Hu Min xu Chen Wang saisheng xu David Wei Zhang 《National Science Open》 2023年第2期37-45,共9页
Non-destructive stress characterization is essential for gate-all-around(GAA)nanosheet(NS)transistors technology,while it is a big challenge to be realized on nanometer-sized GAA devices by using traditional Micro-Ram... Non-destructive stress characterization is essential for gate-all-around(GAA)nanosheet(NS)transistors technology,while it is a big challenge to be realized on nanometer-sized GAA devices by using traditional Micro-Raman spectroscopy due to its light spot far exceeding the device.In this work,a non-destructive stress characterization methodology of confocal Raman spectroscopy was proposed and performed for GAANS device fabrication.Channel stress evolution along the fabrication process was successfully characterized by designing high-density NS array and analyzing the linear scanned spectra in different structures.The related mechanism of stress evolution was systematically studied by Sentaurus process simulation.Additionally,applying this methodology on detecting the bending of suspended NS after channel release process was demonstrated.Therefore,this work might provide a promising solution to realize in-line characterization of channel stress in GAA NS transistors and process monitor of NS channel integrity. 展开更多
关键词 non-destructive characterization channel stress gate all around(GAA) confocal Raman
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