Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material

Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.

液压挤压对复合铸造Al3003/Al4004包覆材料显微组织的影响(英文)

研究液压对混合复合铸造Al 3003/Al 4004包覆材料微观组织变化的影响。复合铸造Al 3003/Al 4004包覆材料试样为圆形,由Al 3003(外部)和Al 4004(内部)材料组成。采用液压设备,在温度423 K、挤压比5的条件下制造试样。在挤压之前,Al 4004材料的直径为80 mm,Al 3003材料的厚度为35 mm,在挤压后,2种材料的直径和厚度分别为30 mm和5 mm。研究了2个试样的微观组织和硬度。在挤压之前,复合铸造Al 3003/Al 4004包覆材料横截面的硬度以抛物线的形式向中心增大。然而,在挤压后,Al 4004材料的硬度几乎没有变化。在挤压之前,Al 3003和Al 4004材料的界面存在大量直径超过1 mm的大空洞,这些大空洞随着液压过程的进行而消失。