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银含量对快速热冲击下Sn−xAg−0.5Cu焊点显微组织和力学性能的影响
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作者 彭晨 王善林 +6 位作者 吴鸣 尹立孟 陈玉华 叶科江 陈维政 张体明 谢吉林 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2024年第6期1922-1935,共14页
使用高频感应加热设备研究Ag含量对快速热冲击下Sn−xAg−0.5Cu焊点的显微组织和剪切强度的影响。结果表明,Ag含量的增加使焊点表面更致密光滑,减少焊点内部长条状Cu6Sn5金属间化合物(IMC)的产生,从而提高焊点的抗氧化性。Ag能够加快焊点... 使用高频感应加热设备研究Ag含量对快速热冲击下Sn−xAg−0.5Cu焊点的显微组织和剪切强度的影响。结果表明,Ag含量的增加使焊点表面更致密光滑,减少焊点内部长条状Cu6Sn5金属间化合物(IMC)的产生,从而提高焊点的抗氧化性。Ag能够加快焊点界面IMC层的生长速度,Cu6Sn5层的生长速度由体扩散和晶界扩散共同决定,Cu3Sn层的生长速度由体扩散和界面反应共同决定。在快速热冲击环境下,焊点的断裂模式从韧性断裂转变为脆性断裂,而高Ag含量使得焊点的断裂模式转变时间更短,降低焊点的抗热疲劳性能。 展开更多
关键词 Ag含量 快速热冲击 Sn−Ag−Cu 焊点 生长动力学 断裂模式
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快速热冲击下SAC305/Cu焊点氧化行为与金属间化合物生长动力学 被引量:1
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作者 吴鸣 王善林 +8 位作者 尹立孟 陈玉华 洪敏 孙文君 姚宗湘 倪佳明 卢鹏 张体明 谢吉林 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2023年第10期3054-3066,共13页
通过电磁感应加热装置,研究SAC305/Cu焊点氧化行为和界面金属间化合物(IMC)生长动力学。结果表明,快速热冲击下焊点自身氧化行为是主要因素,内部的Cu6Sn5IMC会加剧焊点的氧化。Cu_(6)Sn_(5)层的生长由晶界扩散控制,Cu_(3)Sn层的生长则... 通过电磁感应加热装置,研究SAC305/Cu焊点氧化行为和界面金属间化合物(IMC)生长动力学。结果表明,快速热冲击下焊点自身氧化行为是主要因素,内部的Cu6Sn5IMC会加剧焊点的氧化。Cu_(6)Sn_(5)层的生长由晶界扩散控制,Cu_(3)Sn层的生长则由体扩散控制。基底溶解的Cu原子主要扩散到界面IMC和焊料的内部。在快速热冲击下,焊点剪切强度大幅度降低,72 h后下降49.2%。断裂机制由韧性断裂向韧脆性混合断裂转变,最终转变为脆性断裂。 展开更多
关键词 感应加热 氧化膜 SAC305 金属间化合物 剪切强度
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Fracture pattern evolution of SnAgCu−SnPb mixed solder joints at cryogenic temperature 被引量:4
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作者 Ming WU shan-lin wang +3 位作者 Wen-jun SUN Min HONG Yu-hua CHEN Li-ming KE 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第9期2762-2772,共11页
The effect of cryogenic temperatures on the mechanical properties and fracture mechanism of SnAgCu−SnPb mixed solder joints was investigated.The results showed that the tensile strength of mixed solder joints first in... The effect of cryogenic temperatures on the mechanical properties and fracture mechanism of SnAgCu−SnPb mixed solder joints was investigated.The results showed that the tensile strength of mixed solder joints first increased with the increase of Pb content and reached its maximum at 22.46 wt.%Pb;subsequently,it decreased as Pb content increased.However,cryogenic temperatures improved the tensile strength of the solder joints.Both Pb content and cryogenic temperature caused the fracture mode of the mixed solder joints to change;however,temperature remained the main influencing factor.As the temperature fell from 298 to 123 K,the failure pattern in the solder joints transformed from ductile fracture to quasi-ductile fracture to quasi-brittle fracture and finally,to brittle fracture. 展开更多
关键词 fracture pattern tensile strength SnAgCu−SnPb solder cryogenic temperature
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Corrosion behaviors of thermally grown oxide films on Fe-based bulk metallic glasses 被引量:1
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作者 Hong-xiang Li shan-lin wang +1 位作者 Yeonuk Jeong Seonghoon Yi 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2012年第8期726-732,共7页
Oxide films formed on the surfaces of Fe-based bulk metallic glasses in the temperature range between 373 K and 573 K were characterized and their effects on the corrosion behaviors were investigated by microstructura... Oxide films formed on the surfaces of Fe-based bulk metallic glasses in the temperature range between 373 K and 573 K were characterized and their effects on the corrosion behaviors were investigated by microstructural and electrochemical analysis. The oxide film formed at 573 K is iron-rich oxide and it exhibits an n-type semiconductor at a higher potential than 0.35 V and a p-type semiconductor at a lower potential than 0.35 V. Capacitance measurements show that the donor density decreases with the increase in oxidation temperature, while the thickness of the space charge layer increases with the oxidation temperature rising. The result of immersion tests shows that the mass loss rate increases with the oxidation temperature rising. Therefore, the correlation between microstructure and corrosion resistance needs to be proposed because the corrosion resistance is deteriorated with the development of the oxide films. 展开更多
关键词 bulk metallic glass oxide films CORROSION CAPACITANCE
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Continuous droplet rebound on heated surfaces and its effects on heat transfer property: A lattice Boltzmann study
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作者 Qing-Yu Zhang Qi-Peng Dong +2 位作者 shan-lin wang Zhi-Jun wang Jian Zhou 《Chinese Physics B》 SCIE EI CAS CSCD 2021年第4期351-360,共10页
A thermal multiphase lattice Boltzmann(LB) model is used to study the behavior of droplet impact on hot surface and the relevant heat transfer properties.After validating the correctness of the codes through the D^(2)... A thermal multiphase lattice Boltzmann(LB) model is used to study the behavior of droplet impact on hot surface and the relevant heat transfer properties.After validating the correctness of the codes through the D^(2) law,the simulations of intrinsic contact angle and the temperature-dependent surface tension are performed.The LB model is then used to simulate the droplet impact on smooth and micro-hole heated surface.On the smooth surface,the impinging droplet is reluctant to rebound,unless the intrinsic wettability of the solid surface is fairly good.On the micro-hole surface,however,the micro-holes provide favorable sites for generating a high-pressure vapor cushion underneath the impinging droplet,which thereby facilitates the continuous droplet rebound.For the continuously rebounding droplet.The time evolution of volume and temperature display obvious oscillations.The achievable height of the rebounding droplet increases as the intrinsic wettability of the solid surface becomes better,and the maximum transient heat flux is found to be directly proportional to the droplet rebounding height.Within a certain time interval,the continuous rebounding behavior of the droplet is favorable for enhancing the total heat quantity/heat transfer efficiency,and the influence of intrinsic wettability on the total heat during droplet impingement is greater than that of the superheat.The LB simulations not only present different states of droplets on hot surfaces,but also guide the design of the micro-hole surface with desirable heat transfer properties. 展开更多
关键词 droplet rebound heat transfer droplet impact lattice Boltzmann model
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