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Modeling of Amperometric Immunosensor for CMOS Integration 被引量:1
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作者 Ce Li Haigang Yang +1 位作者 shanhong xia Chao Bian 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2006年第A03期439-442,共4页
A circuit model of the Amperometric immunosensor for use in the biosensor system-on-chip simulation is proposed in this paper.The model parameters are extracted with several methods and verified by MATLAB and SPICE si... A circuit model of the Amperometric immunosensor for use in the biosensor system-on-chip simulation is proposed in this paper.The model parameters are extracted with several methods and verified by MATLAB and SPICE simulation.A CMOS potentiostat circuit required for conditioning the Amperometric immunosensor is also included in the circuit model.The mean square error norm of the simulated curve against the measured one is 8.65×10^(-17) The whole circuit has been fabricated in a 0.35μm CMOS process. 展开更多
关键词 AMPEROMETRIC MICROELECTRODE circuit model POTENTIOSTAT FOLDED-CASCODE
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A Full CMOS Integration Including ISFET Microsensors and Interface Circuit for Biochemical Applications 被引量:1
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作者 Jinbao Wei Haigang Yang +2 位作者 Hongguang Sun Zengjin Lin shanhong xia 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2006年第A03期443-446,共4页
One of today's challenges is the integration of ISFETs in chemical and biochemical Microsystems.This article presents a full integration of ISFET chip containing the ISFET/REFET(reference FET) pair,ISFET/REFET amp... One of today's challenges is the integration of ISFETs in chemical and biochemical Microsystems.This article presents a full integration of ISFET chip containing the ISFET/REFET(reference FET) pair,ISFET/REFET amplifiers,bias current generator,as well as a reference electrode structure,all integrated on the same chip based on CMOS technology.The sensor chip was fabricated in a standard 0.35μm CMOS process(Chartered Semiconductor,Singapore).The extra post processing steps have been developed and added for depositing membranes.Finally,the pH response of the integrated sensor was measured with the interface circuit. 展开更多
关键词 ISFET interface circuit integration and post processing
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Single-chip 3D electric field microsensor 被引量:3
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作者 Biyun LING Yu WANG +4 位作者 Chunrong PENG Bing LI Zhaozhi CHU Bin LI shanhong xia 《Frontiers of Mechanical Engineering》 SCIE CSCD 2017年第4期581-590,共10页
This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same st... This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0-50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measure- ment errors of the three electrostatic field components are less than 14.04%. 展开更多
关键词 electric field microsensor three-dimensional single-chip in-plane rotation
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Exploiting articulatory features for pitch accent detection
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作者 Junhong ZHAO Ji XU +3 位作者 Wei-qiang ZHANG Hua YUAN Jia LIU shanhong xia 《Journal of Zhejiang University-Science C(Computers and Electronics)》 SCIE EI 2013年第11期835-844,共10页
Articulatory features describe how articulators are involved in making sounds.Speakers often use a more exaggerated way to pronounce accented phonemes,so articulatory features can be helpful in pitch accent detection.... Articulatory features describe how articulators are involved in making sounds.Speakers often use a more exaggerated way to pronounce accented phonemes,so articulatory features can be helpful in pitch accent detection.Instead of using the actual articulatory features obtained by direct measurement of articulators,we use the posterior probabilities produced by multi-layer perceptrons(MLPs) as articulatory features.The inputs of MLPs are frame-level acoustic features pre-processed using the split temporal context-2(STC-2) approach.The outputs are the posterior probabilities of a set of articulatory attributes.These posterior probabilities are averaged piecewise within the range of syllables and eventually act as syllable-level articulatory features.This work is the first to introduce articulatory features into pitch accent detection.Using the articulatory features extracted in this way,together with other traditional acoustic features,can improve the accuracy of pitch accent detection by about 2%. 展开更多
关键词 Articulatory features Pitch accent detection PROSODY Computer-aided language learning(CALL) Multi-layer perceptron(MLP)
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