BACKGROUND Skin bronchogenic cysts are extremely rare congenital bronchocystic changes caused by the abnormal development of the trachea,bronchial trees or lung buds during the embryonic period.The first case of skin ...BACKGROUND Skin bronchogenic cysts are extremely rare congenital bronchocystic changes caused by the abnormal development of the trachea,bronchial trees or lung buds during the embryonic period.The first case of skin bronchogenic cysts was reported in 1945.Since then,this disease has attracted increasing attention,but due to the low incidence,its pathogenesis is still not clear.CASE SUMMARY Here,we report another case of skin bronchogenic cysts with infection in a 64-year-old female patient.The patient had no symptoms for more than 60 years until her chest wall was recently found to be swollen,and she felt pain and discomfort.At the same time,secretions were found on the surface of the swelling.Color Doppler ultrasound examination showed abnormal echoes in the soft tissue under the frontal chest wall,suggesting the presence of cysts.Cytological puncture resulted in about 2 mL of pus and showed the presence of more acute inflammatory cells.The final clinical diagnosis was skin cyst with infection,and surgery was carried out.The pathological results obtained after surgery showed that the cystic wall was covered with column-like cilia epithelial cells,and the interstitial structure was partially inundated with inflammatory cells.After a variety of examinations and clinical diagnoses,we finally confirmed that the patient was suffering from bronchogenic cyst.CONCLUSION This article not only describes the case of an elderly patient with rare skin bronchogenic cysts with infection but also provides a detailed and correct diagnosis and a successful treatment process,which is of great value for the diagnosis and treatment of the disease.展开更多
Manufacturing and integration of micro-electro-mechanical systems(MEMS) devices and integrated circuits(ICs) by wafer bonding often generate problems caused by thermal properties of materials.This paper presents a low...Manufacturing and integration of micro-electro-mechanical systems(MEMS) devices and integrated circuits(ICs) by wafer bonding often generate problems caused by thermal properties of materials.This paper presents a low temperature wafer direct bonding process assisted by O2 plasma.Silicon wafers were treated with wet chemical cleaning and subsequently activated by O2 plasma in the etch element of a sputtering system.Then,two wafers were brought into contact in the bonder followed by annealing in N2 atmosphere for several hours.An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy.The bonding yield reaches 90%-95% and the achieved surface energy is 1.76 J/m2 when the bonded wafers are annealed at 350 ℃ in N2 atmosphere for 2 h.Void formation was systematically observed and elimination methods were proposed.The size and density of voids greatly depend on the annealing temperature.Short O2 plasma treatment for 60 s can alleviate void formation and enhance surface energy.A pulling test reveals that the bonding strength is more than 11.0 MPa.This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration,system on chip,and MEMS packaging.展开更多
文摘BACKGROUND Skin bronchogenic cysts are extremely rare congenital bronchocystic changes caused by the abnormal development of the trachea,bronchial trees or lung buds during the embryonic period.The first case of skin bronchogenic cysts was reported in 1945.Since then,this disease has attracted increasing attention,but due to the low incidence,its pathogenesis is still not clear.CASE SUMMARY Here,we report another case of skin bronchogenic cysts with infection in a 64-year-old female patient.The patient had no symptoms for more than 60 years until her chest wall was recently found to be swollen,and she felt pain and discomfort.At the same time,secretions were found on the surface of the swelling.Color Doppler ultrasound examination showed abnormal echoes in the soft tissue under the frontal chest wall,suggesting the presence of cysts.Cytological puncture resulted in about 2 mL of pus and showed the presence of more acute inflammatory cells.The final clinical diagnosis was skin cyst with infection,and surgery was carried out.The pathological results obtained after surgery showed that the cystic wall was covered with column-like cilia epithelial cells,and the interstitial structure was partially inundated with inflammatory cells.After a variety of examinations and clinical diagnoses,we finally confirmed that the patient was suffering from bronchogenic cyst.CONCLUSION This article not only describes the case of an elderly patient with rare skin bronchogenic cysts with infection but also provides a detailed and correct diagnosis and a successful treatment process,which is of great value for the diagnosis and treatment of the disease.
基金Project supported by the Foreign Cultural and Educational Experts Employing Plan,Ministry of Education,China (No. TS2010CQDX 056)the Fundamental Research Funds for the Central Universi-ties,China (No. CDJZR12135502)
文摘Manufacturing and integration of micro-electro-mechanical systems(MEMS) devices and integrated circuits(ICs) by wafer bonding often generate problems caused by thermal properties of materials.This paper presents a low temperature wafer direct bonding process assisted by O2 plasma.Silicon wafers were treated with wet chemical cleaning and subsequently activated by O2 plasma in the etch element of a sputtering system.Then,two wafers were brought into contact in the bonder followed by annealing in N2 atmosphere for several hours.An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy.The bonding yield reaches 90%-95% and the achieved surface energy is 1.76 J/m2 when the bonded wafers are annealed at 350 ℃ in N2 atmosphere for 2 h.Void formation was systematically observed and elimination methods were proposed.The size and density of voids greatly depend on the annealing temperature.Short O2 plasma treatment for 60 s can alleviate void formation and enhance surface energy.A pulling test reveals that the bonding strength is more than 11.0 MPa.This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration,system on chip,and MEMS packaging.