It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics,can be accelerated through a fundamental understanding of phase ...It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics,can be accelerated through a fundamental understanding of phase transformation and microstructure control in Pb-free solder joints.Advanced characterization techniques including synchrotron radiation provide a comprehensive toolset to measure the composition,crystallography,morphology,and properties of the major components of solder alloys.The research using such techniques is reviewed in detail including the characterization of the eff ects of microalloy additions on the microstructure and properties of Pb-free solder joints,especially those on the intermetallic phases.The discoveries outlined are of scientific and industrial relevance and have implications for new solder alloy composition design and the reliability of lead-free solder joints.展开更多
基金the funding from the National Natural Science Foundation of China(No.51904352)the Natural Science Foundation of Hunan Province(No.2020JJ5758)+3 种基金the State Key Laboratory of Solidification Processing in NPU(Grant No.SKLSP201904)funding from the University of Queensland-Nihon Superior Collaborative Research Programme(Grant No.2016001895)the Australian Research Council(ARC)Discovery(DP200101949)and Linkage(LP180100595)grantsthe financial support from JSPS KAKENHI(Grant No.JP17H06155)。
文摘It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics,can be accelerated through a fundamental understanding of phase transformation and microstructure control in Pb-free solder joints.Advanced characterization techniques including synchrotron radiation provide a comprehensive toolset to measure the composition,crystallography,morphology,and properties of the major components of solder alloys.The research using such techniques is reviewed in detail including the characterization of the eff ects of microalloy additions on the microstructure and properties of Pb-free solder joints,especially those on the intermetallic phases.The discoveries outlined are of scientific and industrial relevance and have implications for new solder alloy composition design and the reliability of lead-free solder joints.
