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A review of the etched terminal structure of a 4H-SiC PiN diode
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作者 Hang Zhou Jingrong Yan +8 位作者 Jialin Li Huan Ge Tao Zhu Bingke Zhang shucheng chang Junmin Sun Xue Bai Xiaoguang Wei Fei Yang 《Journal of Semiconductors》 EI CAS CSCD 2023年第11期69-78,共10页
The comparison of domestic and foreign studies has been utilized to extensively employ junction termination extension(JTE)structures for power devices.However,achieving a gradual doping concentration change in the lat... The comparison of domestic and foreign studies has been utilized to extensively employ junction termination extension(JTE)structures for power devices.However,achieving a gradual doping concentration change in the lateral direction is difficult for SiC devices since the diffusion constants of the implanted aluminum ions in SiC are much less than silicon.Many previously reported studies adopted many new structures to solve this problem.Additionally,the JTE structure is strongly sensitive to the ion implantation dose.Thus,GA-JTE,double-zone etched JTE structures,and SM-JTE with modulation spacing were reported to overcome the above shortcomings of the JTE structure and effectively increase the breakdown voltage.They provided a theoretical basis for fabricating terminal structures of 4H-SiC PiN diodes.This paper summarized the effects of different terminal structures on the electrical properties of SiC devices at home and abroad.Presently,the continuous development and breakthrough of terminal technology have significantly improved the breakdown voltage and terminal efficiency of 4H-SiC PiN power diodes. 展开更多
关键词 PiN diode terminal structure mesa-JTE reverse breakdown voltage etching process
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