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面向FC-BGA的增层胶膜封装基板镀铜工艺
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作者 李鹏 于均益 +4 位作者 罗遂斌 赖志强 肖彬 于淑会 孙蓉 《中国科学:化学》 CAS CSCD 北大核心 2023年第10期1866-1879,共14页
近年来,基于增层胶膜材料,采用半加成法工艺生产制造窄线宽/线距电子线路的倒装芯片球栅阵列(FCBGA)封装基板的相关技术发展迅速.增层胶膜材料微观结构及其物理、化学性质、镀铜工艺参数和化学药水等多个因素共同决定线路精细度和结合力... 近年来,基于增层胶膜材料,采用半加成法工艺生产制造窄线宽/线距电子线路的倒装芯片球栅阵列(FCBGA)封装基板的相关技术发展迅速.增层胶膜材料微观结构及其物理、化学性质、镀铜工艺参数和化学药水等多个因素共同决定线路精细度和结合力,并最终影响封装基板的品质和可靠性,其内在关联性值得关注和深入研究.本文基于FC-BGA增层胶膜封装基板的导电互连制造技术,重点探讨半加成法工艺所用化学药水的成分及作用,并结合镀铜的性能评价,提出未来进一步提高封装基板线路品质的发展方向. 展开更多
关键词 封装基板 增层胶膜 倒装芯片球栅阵列 镀铜 半加成法 精细线路
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High-fidelity and clean nanotransfer lithography using structure-embedded and electrostatic-adhesive carriers 被引量:1
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作者 Zhuofei Gan Jingxuan Cai +11 位作者 Zhao Sun Liyang Chen Chuying Sun Junyi yu Zeyu Liang Siyi Min Fei Han yu Liu Xing Cheng shuhui yu Dehu Cui Wen-Di Li 《Microsystems & Nanoengineering》 SCIE CSCD 2023年第1期253-261,共9页
Metallic nanostructures are becoming increasingly important for both fundamental research and practical devices.Many emerging applications employing metallic nanostructures often involve unconventional substrates that... Metallic nanostructures are becoming increasingly important for both fundamental research and practical devices.Many emerging applications employing metallic nanostructures often involve unconventional substrates that are flexible or nonplanar,making direct lithographic fabrication very difficult.An alternative approach is to transfer prefabricated structures from a conventional substrate;however,it is still challenging to maintain high fidelity and a high yield in the transfer process.In this paper,we propose a high-fidelity,clean nanotransfer lithography method that addresses the above challenges by employing a polyvinyl acetate(PVA)film as the transferring carrier and promoting electrostatic adhesion through triboelectric charging.The PVA film embeds the transferred metallic nanostructures and maintains their spacing with a remarkably low variation of<1%.When separating the PVA film from the donor substrate,electrostatic charges are generated due to triboelectric charging and facilitate adhesion to the receiver substrate,resulting in a high large-area transfer yield of up to 99.93%.We successfully transferred the metallic structures of a variety of materials(Au,Cu,Pd,etc.)with different geometries with a<50-nm spacing,high aspect ratio(>2),and complex 3D structures.Moreover,the thin and flexible carrier film enables transfer on highly curved surfaces,such as a single-mode optical fiber with a curvature radius of 62.5μm.With this strategy,we demonstrate the transfer of metallic nanostructures for a compact spectrometer with Cu nanogratings transferred on a convex lens and for surface-enhanced Raman spectroscopy(SERS)characterization on graphene with reliable responsiveness. 展开更多
关键词 TRANSFER TRANSFERRED film
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Surface-modified barium titanate by MEEAA for high-energy storage application of polymer composites
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作者 Yanbin Shen Suibin Luo +2 位作者 shuhui yu Rong Sun Ching-Ping Wong 《High Voltage》 SCIE EI 2016年第4期175-180,共6页
In this study,2-[2-(2-methoxyethoxy)ethoxy]acetic acid(MEEAA)was used to modify the surface of barium titanate nanoparticles(BT NPs)to enhance the compatibility and dispersion of the BT ceramic fillers in polymer matr... In this study,2-[2-(2-methoxyethoxy)ethoxy]acetic acid(MEEAA)was used to modify the surface of barium titanate nanoparticles(BT NPs)to enhance the compatibility and dispersion of the BT ceramic fillers in polymer matrix.A uniform coating layer with a thickness about 2 nm was formed on the surface of BT after modification.The poly(vinylidene fluoride)-hexafluoropropene[P(VDF-HFP)]composites filled with MEEAA-modified BT NPs achieved higher permittivity(∼13 at 3.0 vol%filler)and discharged energy density than that of the untreated BT filled composite.The maximum discharge energy density of 7.8 J/cm^(3)was obtained in the nanocomposites with 3 vol%MEEAA-modified BT NPs at electric field of 425 kV/mm,which is 77%higher than that of 4.4 J/cm^(3)of pure P(VDF-HFP)film at electric field of 420 kV/mm. 展开更多
关键词 COMPOSITES BARIUM MODIFIED
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