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Design and fabrication of silicon-tessellated structures for monocentric imagers 被引量:2
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作者 Tao Wu stephen s.hamann +3 位作者 Andrew C.Ceballos Chu-En Chang Olav Solgaard Roger T.Howe 《Microsystems & Nanoengineering》 EI 2016年第1期213-221,共9页
Compared with conventional planar optical image sensors,a curved focal plane array can simplify the lens design and improve the field of view.In this paper,we introduce the design and implementation of a segmented,hem... Compared with conventional planar optical image sensors,a curved focal plane array can simplify the lens design and improve the field of view.In this paper,we introduce the design and implementation of a segmented,hemispherical,CMOS-compatible silicon image plane for a 10-mm diameter spherical monocentric lens.To conform to the hemispherical focal plane of the lens,we use flexible gores that consist of arrays of spring-connected silicon hexagons.Mechanical functionality is demonstrated by assembling the 20-μm-thick silicon gores into a hemispherical test fixture.We have also fabricated and tested a photodiode array on a siliconon-insulator substrate for use with the curved imager.Optical testing shows that the fabricated photodiodes achieve good performance;the hemispherical imager enables a compact 160°field of view camera with >80% fill factor using a single spherical lens. 展开更多
关键词 curved image plane monocentric imager PHOTODIODE recessed negative trench profile
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