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Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films 被引量:2
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作者 taoqing huang Xinyu Zhang +5 位作者 Tian Wang Honggang Zhang Yongwei Li Hua Bao Min Chen Limin Wu 《Nano-Micro Letters》 SCIE EI CAS CSCD 2023年第1期14-24,共11页
While boron nitride(BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties,a... While boron nitride(BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties,a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interracial interaction causing severe phonon scattering.Here,we report a novel surface modification strategy called the "self-modified nanointerface" using BN nanocrystals(BNNCs) to efficiently link the interface between BN and the polymer matrix.Combining with ice-press assembly method,an only 25 wt% BNembedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m-1K-1but also,more importantly,achieve a through-plane thermal conductivity as high as 21.3 W m-1K-1,which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers,the strong interaction between the self-modified fillers and polymer matrix,as well as ladder-structured BN skeleton.The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU.This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites. 展开更多
关键词 Thermal management materials Boron nitride Thermal conductivity Interfacial thermal resistance
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聚合物/氮化硼复合导热材料研究进展 被引量:5
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作者 徐万顷 黄桃青 +2 位作者 李永伟 陈敏 武利民 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2021年第1期284-291,共8页
随着电子信息技术的发展,电子器件逐步趋于小型化、高功率与高密度集成化,其散热问题成为保障器件可靠性运转的关键。目前,聚合物材料由于成本低,成型工艺完善等优势,成为高性能导热材料研究重点。受制于聚合物较低的本征热导率,以高导... 随着电子信息技术的发展,电子器件逐步趋于小型化、高功率与高密度集成化,其散热问题成为保障器件可靠性运转的关键。目前,聚合物材料由于成本低,成型工艺完善等优势,成为高性能导热材料研究重点。受制于聚合物较低的本征热导率,以高导热六方氮化硼(h-BN)作为填料改性的聚合物/BN复合材料,因兼具高导热性能与电气绝缘的双重优势,最有潜力解决电子器件高效散热问题。文中从h-BN片层剥离、表面改性及在基体中的取向排列等方面,介绍聚合物/BN复合导热材料近年来的研究进展。 展开更多
关键词 六方氮化硼 高导热复合材料 取向排列 柔性材料
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