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Effect of Applied Current Density on Morphological and Structural Properties of Electrodeposited Fe-Cu Films 被引量:1
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作者 umut sarac M.Celalettin Baykul 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2012年第11期1004-1009,共6页
A detailed study has been carried out to investigate the effect of applied current density on the composition, crystallographic structure, grain size, and surface morphology of Fe-Cu films. X-ray diffraction (XRD) r... A detailed study has been carried out to investigate the effect of applied current density on the composition, crystallographic structure, grain size, and surface morphology of Fe-Cu films. X-ray diffraction (XRD) results show that the films consist of a mixture of face-centered cubic (fcc) Cu and body centered cubic (bcc) ^-Fe phases. The average crystalline size of both Fe and Cu particles decreases as the applied current density becomes more negative. Compositional analysis of Fe-Cu films indicates that the Fe content within the films increases with decreasing current density towards more negative values. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) have been used to investigate the surface morphology of Fe-Cu films. It is observed that the surface morphology of the films changes from dendritic structure to a cauliflower structure as the applied current density becomes more negative. The surface roughness and grain size of the Fe-Cu films decrease with decreasing applied current density towards more negative values. 展开更多
关键词 ELECTRODEPOSITION Surface morphology Current density Grain size COMPOSITION
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Characterization of Microstructural and Morphological Properties in As-deposited Ta/NiFe/IrMn/CoFe/Ta Multilayer System 被引量:1
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作者 Ramis Mustafa ksoglu umut sarac +1 位作者 Mustafa Yildirm Hakan inar 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2014年第4期359-364,共6页
Surface morphology and its relationship with microstructure in Ta/NiFe/IrMn/CoFe/Ta multilayer system deposited by pulsed DC magnetron sputtering have been investigated in dependence of Ta buffer and NiFe seed layer t... Surface morphology and its relationship with microstructure in Ta/NiFe/IrMn/CoFe/Ta multilayer system deposited by pulsed DC magnetron sputtering have been investigated in dependence of Ta buffer and NiFe seed layer thicknesses using atomic force microscopy. The structural parameters such as grain size, dislocation density, texture and strain were calculated. For each surface, a self-affinity behavior with mean fractal dimensions in the range of 2.03-2.18 was found. Additionally, it was also observed that the surface of all samples has locally smooth textured surface structure in the short range. The texture aspect parameter and texture direction index have been obtained for isotropy/anisotropy surface texture. A significant relationship between the surface texture and the strength of the 〈111〉 texture in IrMn layer has been found. The analysis indicated that the surface roughness is strongly affected by the thicknesses of the NiFe seed and Ta buffer layers. 展开更多
关键词 Pulsed DC magnetron sputtering Surface roughness Strain and texture
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