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Increase Activity Cavitations in Liquids and Melts at Ultrasonics Processing 被引量:1
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作者 vladimir l. lanin 《Open Journal of Acoustics》 2013年第3期13-15,共3页
Increase of efficiency of cavitation processes in liquids and melts is reached by gas cavities saturation with the sizes not exceeding the resonant sizes of cavitation germs. Gas saturation of liquids and melts raises... Increase of efficiency of cavitation processes in liquids and melts is reached by gas cavities saturation with the sizes not exceeding the resonant sizes of cavitation germs. Gas saturation of liquids and melts raises level of cavitation pressure upon 20% - 25% that intensifies US processing: cleaning, soldering and metallization. 展开更多
关键词 ULTRASONIC CAVITATION Gas CAVITIES Liquids MELTS
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Increase Ultrasonics Cleaning Efficiency of Electronics Modules 被引量:1
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作者 vladimir l. lanin vladimir S. Tomal 《Engineering(科研)》 2013年第2期191-195,共5页
The new approach is offered for the cleaning applications of electronics modules. The modular systems of the distributed ultrasonics converters, which are established in chessboard order, provide the uniformity cavita... The new approach is offered for the cleaning applications of electronics modules. The modular systems of the distributed ultrasonics converters, which are established in chessboard order, provide the uniformity cavitation fields in ultrasonic bath. The effect of periodic deviation of ultrasonics frequency created the directed acoustic currents in the liquid, witch increase removal pollution process. The technological parameters of automated ultrasonics cleaning lines as concentration SAS, temperature of washing solutions, and ultrasonics cavitation power are optimized. 展开更多
关键词 ULTRASONICS CLEANING ELECTRONICS MODULES CAVITATION FIELDS
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High-Frequency Heating for Soldering in Electronics
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作者 vladimir l. lanin 《Circuits and Systems》 2012年第3期238-241,共4页
Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect;high density o... Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect;high density of energy;process- ing in any environment, including vacuum or inert gas;high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces. 展开更多
关键词 HF HEATING INDUCTOR SOLDERING Electronic MODULES
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