The number of the dummy via can significantly affect the interconnect average temperature.This paper explores the modeling of the interconnect average temperature in the presence of multiple dummy vias.The proposed mo...The number of the dummy via can significantly affect the interconnect average temperature.This paper explores the modeling of the interconnect average temperature in the presence of multiple dummy vias.The proposed model incorporates the multi-via effect into the effective thermal conductivity of the interlayer dielectric (ILD) to obtain accurate results.Using different ILDs,the multi-via effect is analyzed and discussed.Also,the extended applications of the multi-via effect are presented in this paper to obtain the minimum interconnect average temperature increase with a given via separation or number.This study suggests that the multi-via effect should be accounted for in integrated circuits design to optimize the performance and design accuracy of integrated circuits.展开更多
基金supported by the National Natural Science Foundation of China (60606006)the National Science Fund for Distinguished Young Scholars of China (60725415)the Basic Science Research Fund of Xidian University
文摘The number of the dummy via can significantly affect the interconnect average temperature.This paper explores the modeling of the interconnect average temperature in the presence of multiple dummy vias.The proposed model incorporates the multi-via effect into the effective thermal conductivity of the interlayer dielectric (ILD) to obtain accurate results.Using different ILDs,the multi-via effect is analyzed and discussed.Also,the extended applications of the multi-via effect are presented in this paper to obtain the minimum interconnect average temperature increase with a given via separation or number.This study suggests that the multi-via effect should be accounted for in integrated circuits design to optimize the performance and design accuracy of integrated circuits.
