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Characterization of the Nanoscale Microstructure of an Immersion Silver on Sputtered Copper 被引量:6
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作者 TANG Dian wei zhe-liang +3 位作者 SHAO Yan-Qun YOU Shao-Xin O'KEEFE Mathew O' KEEFE Thomas 《Chinese Journal of Structural Chemistry》 SCIE CAS CSCD 北大核心 2005年第8期935-939,共5页
Silver has grown its attraction of the scientists in microelectronic field recently.Electrochemical deposition of silver onto copper substrates by immersion method has been one of the keen topics. In this study, ethan... Silver has grown its attraction of the scientists in microelectronic field recently.Electrochemical deposition of silver onto copper substrates by immersion method has been one of the keen topics. In this study, ethanol was used as the plating solution in which some chemicals were added. The silver deposits were characterized by a field emission scanning electron microscopy (FESEM), an atom force microscope (AFM), a transmission electron microscope (TEM) and a selected area electron diffraction (SAED). It was found that silver immersion using ethanol-based bath has good coverage feature. The highlands of the copper substrate are coated by silver particles whose sizes are around 12 nm, but those sizes at low-lying lands are a little smaller. 展开更多
关键词 SILVER IMMERSION COPPER NANOPARTICLES
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