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Fabrication of thick BOX SOI by Smart-cut technology
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作者 wu yan-jun, zhang miao, an zheng-hua, lin cheng-lu(state key laboratory of functional materials for informatics, shanghai institute of microsystem and information technology,the chinese academy of sciences, shanghai 200050) 《Nuclear Science and Techniques》 SCIE CAS CSCD 2003年第2期115-118,共4页
A SOI material with thick BOX (2.2 μm) was successfully fabricated using the Smart-cut technology. The thick BOX SOI microstructures were investigated by high resolution cross-sectional transmission electron microsco... A SOI material with thick BOX (2.2 μm) was successfully fabricated using the Smart-cut technology. The thick BOX SOI microstructures were investigated by high resolution cross-sectional transmission electron microscopy (XTEM), while the electrical properties were studied by the spreading resistance profile (SRP). Experimental results demonstrate that both structural and electrical properties of the SOI structure are very good. 展开更多
关键词 灵活切割技术 微观结构 截面透射电子显微镜 XTEM 电学特性 绝缘硅片 SOI
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