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Strain in GaN/Si<111> by RBS/Channeling
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作者 CHENChang-Chun wuming-fang 《Nuclear Science and Techniques》 SCIE CAS CSCD 2002年第1期37-41,共5页
GaN film grown on Si substrate was characterized by Rutherford backscattering/Channeling (RBS/C). The experimental results show that the thick- ness of GaN epilayer is about 2.5 μm and the GaN film has a good crystal... GaN film grown on Si substrate was characterized by Rutherford backscattering/Channeling (RBS/C). The experimental results show that the thick- ness of GaN epilayer is about 2.5 μm and the GaN film has a good crystalline quality (Xmin=3.3%). By using channeling angular scanning. the 0.35% of average tetragonal distortion in GaN layer is observed. In addition, the depth profiles of strain in GaN film layer reveal that the strain in GaN film nonlinearly decreases with the increase of film thickness. The strain-free thickness (above 2.5 μm) of GaN film on Si substrate is far below that (150μm) of GaN film on Sapphire. 展开更多
关键词 光发射二极管 GAN薄膜 硅衬底
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