In-Situ Atomic-Scale Observation of Brownmillerite to Ruddlesden-Popper Phase Transition Tuned by Epitaxial Strain in Cobaltites

Phase transitions involving oxygen ion extraction within the framework of the crystallographic relevance have been widely exploited for sake of superconductivity,ferromagnetism,and ion conductivity in perovskiterelated oxides.However,atomic-scale pathways of phase transitions and ion extraction threshold are inadequately understood.Here we investigate the atomic structure evolution of LaCoO_(3) films upon oxygen extraction and subsequent Co migration,focusing on the key role of epitaxial strain.The brownmillerite to Ruddlesden-Popper phase transitions are discovered to stabilize at distinct crystal orientations in compressive-and tensile-strained cobaltites,which could be attributed to in-plane and out-of-plane Ruddlesden-Popper stacking faults,respectively.A two-stage process from exterior to interior phase transition is evidenced in compressive-strained LaCoO_(2.5),while a single-step nucleation process leaving bottom layer unchanged in tensile-strained situation.Strain analyses reveal that the former process is initiated by an expansion in Co layer at boundary,whereas the latter one is associated with an edge dislocation combined with antiphase boundary.These findings provide a chemomechanical perspective on the structure regulation of perovskite oxides and enrich insights into strain-dependent phase diagram in epitaxial oxides films.

Enhanced thermal performance from liquid metal in copper/graphite filled elastomer

With the increasing integration level of modern electronics,thermal management becomes an urgent issue for guaranteeing the work efficiency and lifespan of electronics.On the basis of intrinsic high thermal conductivity nature,highly ordered graphite and copper stripes are densely aligned in the silicone gel pads in vertical(VCuGr)and oblique(@15°CuGr)directions to couple the high thermal conductivity and mechanical softness.The wetting nature of liquid metal(LM)on the chemically treated Cu surface is utilized to form a LM layer on the two surfaces of thermal pads.The obtained LM-pad TIMs possessed ultrahigh through-plane thermal conductivity(VCuGr:71.4 W/(m K),@15°CuGr:62.5 W/(m K))under the normal packaging pressure.The thermal resistance decreased from 0.69 cm^(2) K/W to 0.25 cm^(2) K/W with the surface modification with LM.Theoretical simulation and practical thermal dissipation test results further demonstrate the excellent thermal management capability of these composites in high-power electronics.