Development of miniaturized three-dimensional(3 D)fliers with integrated functional components has important implications to a diverse range of engineering areas.Among the various active and passive miniaturized 3 D f...Development of miniaturized three-dimensional(3 D)fliers with integrated functional components has important implications to a diverse range of engineering areas.Among the various active and passive miniaturized 3 D fliers reported previously,a class of 3 D electronic fliers inspired by wind-dispersed seeds show promising potentials,owing to the lightweight and noiseless features,aside from the stable rotational fall associated with a low falling velocity.While on-demand shape-morphing capabilities are essential for those 3 D electronic fliers,the realization of such miniaturized systems remains very challenging,due to the lack of fast-response 3 D actuators that can be seamlessly integrated with 3 D electronic fliers.Here we develop a type of morphable3 D mesofliers with shape memory polymer(SMP)-based electrothermal actuators,capable of large degree of actuation deformations,with a fast response(e.g.,~1 s).Integration of functional components,including sensors,controllers,and chip batteries,enables development of intelligent 3 D mesoflier systems that can achieve the on-demand unfolding,triggered by the processing of real-time sensed information(e.g.,acceleration and humidity data).Such intelligent electronic mesofliers are capable of both the low-air-drag rising and the low-velocity falling,and thereby,can be used to measure the humidity fields in a wide 3 D space by simple hand throwing,according to our demonstrations.The developed electronic mesofliers can also be integrated with other types of physical/chemical sensors for uses in different application scenarios.展开更多
Recent research establishes methods of controlled mechanical assembly as versatile routes to three-dimensional(3D)mesostructures from patterned 2D films,with demonstrated applicability to a broad range of materials(e....Recent research establishes methods of controlled mechanical assembly as versatile routes to three-dimensional(3D)mesostructures from patterned 2D films,with demonstrated applicability to a broad range of materials(e.g.,semiconductors,polymers,metals,and their combinations)and length scales(e.g.,from sub-microscale to centimeter scale).Previously reported schemes use pre-stretched elastomeric substrates as assembly platforms to induce compressive buckling of 2D precursor structures,thereby enabling their controlled transformation into 3D architectures.Here,we introduce tensile buckling as a different,complementary strategy that bypasses the need for a pre-stretched platform,thereby simplifying the assembly process and opening routes to additional classes of 3D geometries unobtainable with compressive buckling.A few basic principles in mechanics serve as guidelines for the design of 2D precursor structures that achieve large out-of-plane motions and associated 3D transformations due to tensile buckling.Experimental and computational studies of nearly 20 examples demonstrate the utility of this approach in the assembly of complex 3D mesostructures with characteristic dimensions from micron to millimeter scales.The results also establish the use of nonlinear mechanics modeling as a mechanism for designing systems that yield desired 3D geometries.A strain sensor that offers visible readout and large detectable strain range through a collection of mechanically triggered electrical switches and LEDs serves as an application example.展开更多
基金support from the National Natural Science Foundation of China(12050004 and 11921002)the Tsinghua National Laboratory for Information Science and Technology,and a grant from the Institute for Guo Qiang,Tsinghua University(2019GQG1012)+3 种基金support from the National Natural Science Foundation of China(11902178)the Natural Science Foundation of Beijing Municipality(3204043)China Postdoctoral Science Foundation(2019M650648)support from the National Natural Science Foundation of China(61904095)。
文摘Development of miniaturized three-dimensional(3 D)fliers with integrated functional components has important implications to a diverse range of engineering areas.Among the various active and passive miniaturized 3 D fliers reported previously,a class of 3 D electronic fliers inspired by wind-dispersed seeds show promising potentials,owing to the lightweight and noiseless features,aside from the stable rotational fall associated with a low falling velocity.While on-demand shape-morphing capabilities are essential for those 3 D electronic fliers,the realization of such miniaturized systems remains very challenging,due to the lack of fast-response 3 D actuators that can be seamlessly integrated with 3 D electronic fliers.Here we develop a type of morphable3 D mesofliers with shape memory polymer(SMP)-based electrothermal actuators,capable of large degree of actuation deformations,with a fast response(e.g.,~1 s).Integration of functional components,including sensors,controllers,and chip batteries,enables development of intelligent 3 D mesoflier systems that can achieve the on-demand unfolding,triggered by the processing of real-time sensed information(e.g.,acceleration and humidity data).Such intelligent electronic mesofliers are capable of both the low-air-drag rising and the low-velocity falling,and thereby,can be used to measure the humidity fields in a wide 3 D space by simple hand throwing,according to our demonstrations.The developed electronic mesofliers can also be integrated with other types of physical/chemical sensors for uses in different application scenarios.
基金Y.Z.acknowledges support from the National Natural Science Foundation of China(#11672152 and#11722217)the Thousand Young Talents Program of China,and the Tsinghua National Laboratory for Information Science and TechnologyY.H.acknowledges the support from the NSF(#CMMI1400169,#CMMI1534120,and#CMMI1635443).
文摘Recent research establishes methods of controlled mechanical assembly as versatile routes to three-dimensional(3D)mesostructures from patterned 2D films,with demonstrated applicability to a broad range of materials(e.g.,semiconductors,polymers,metals,and their combinations)and length scales(e.g.,from sub-microscale to centimeter scale).Previously reported schemes use pre-stretched elastomeric substrates as assembly platforms to induce compressive buckling of 2D precursor structures,thereby enabling their controlled transformation into 3D architectures.Here,we introduce tensile buckling as a different,complementary strategy that bypasses the need for a pre-stretched platform,thereby simplifying the assembly process and opening routes to additional classes of 3D geometries unobtainable with compressive buckling.A few basic principles in mechanics serve as guidelines for the design of 2D precursor structures that achieve large out-of-plane motions and associated 3D transformations due to tensile buckling.Experimental and computational studies of nearly 20 examples demonstrate the utility of this approach in the assembly of complex 3D mesostructures with characteristic dimensions from micron to millimeter scales.The results also establish the use of nonlinear mechanics modeling as a mechanism for designing systems that yield desired 3D geometries.A strain sensor that offers visible readout and large detectable strain range through a collection of mechanically triggered electrical switches and LEDs serves as an application example.
