GaSb p-Channel Metal-Oxide-Semiconductor Field-Effect Transistors with Ni/Pt/Au Source/Drain Ohmic Contacts

GaSb is an attractive candidate for future high-performance Ⅲ-Ⅴ p-channel metal-oxide-semiconductor-field-effect-transistors(pMOSFETs)because of its high hole mobility.The effect of HCl based-chemical cleaning on removing the non-self limiting and instable native oxide layer of GaSb to obtain a clean and smooth surface has been studied.It is observed that the rms roughness of a GaSb surface is significantly reduced from 2.731 nm to 0.693 nm by using HCl:H_(2)O(1:3)solution.The Ni/Pt/Au ohmic contact exhibits an optimal specific contact resistivity of about 6.89×10^(-7)Ω·cm^(2) with a 60 s rapid thermal anneal(RTA)at 250℃.Based on the chemical cleaning and ohmic contact experimental results,inversion-channel enhancement GaSb pMOSFETs are demonstrated.For a 6μm gate length GaSb pMOSFET,a maximum drain current of about 4.0 mA/mm,a drain current on-off(ION/IOFF)ratio of>10^(3),and a subthreshold swing of~250 mV/decade are achieved.Combined with the split C-V method,a peak hole mobility of about 160 cm^(2)/V·s is obtained for a 24μm gate length GaSb pMOSFET.

The Impact of HC1 Precleaning and Sulfur Passivation on the Al2O3/Ge Interface in Ge Metal-Oxide-Semiconductor Capacitors

Surface treatment for Ge substrates using hydrogen chlorine cleaning and chemical passivation are investigated on AuTi/Al2O3/Ge metal-oxide-semiconductor capacitors.After hydrogen chlorine cleaning,a smooth Ge surface almost free from native oxide is demonstrated by atomic force microscopy and x-ray photoelectron spectroscopy observations.Passivation using a hydrogen chlorine solution is found to form a chlorine-terminated surface,while aqueous ammonium sulfide pretreatment results in a surface terminated by Ge-S bonding.Compared with chlorine-passivated samples,the sulfur-passivated ones show less frequency dispersion and better thermal stability based on capacitance-voltage characterizations.The samples with HCl pre-cleaning and (NH4 )2S passivation show less frequency dispersion than the HF pre-cleaning and (NH4)2S passivated ones.The surface treatment process using hydrogen chlorine cleaning followed by aqueous ammonium sulfide passivation demonstrates a promising way to improve gate dielectric/Ge interface quality.

Solid Phase Reactions of Ni-GaAs Alloys for High Mobility Ⅲ-Ⅴ MOSFET Applications

The solid phase reactions of Ni with GaAs substrates are investigated.The experimental results reveal that the Ni-GaAs solid phase reaction forms a ternary phase of Ni2GaAs when annealing temperatures are in the range 250 300℃.As the annealing temperature increases to 400℃,the Ni2GaAs phase starts to decompose due to NiAs phase precipitation.Ni-GaAs alloys processed at 400℃ with a 3min annealing time demonstrate a sheet resistance of 30Ω/square after unreacted Ni removal in hot diluted-HCl solutions.Therefore,Ni-GaAs alloys formed by solid phase reaction could be promising metallic source/drain structures with significant low series resistance for high mobility Ⅲ-Ⅴ metal-oxide-semiconductor field effect transistor (MOSFET) applications.