Polyacrylic acid(PAA)hydrogel composites with different hexagonal boron nitride(h-BN)fillers were synthesized and successfully 3D-printed while their thermal conductivity was systematically studied.With the content of...Polyacrylic acid(PAA)hydrogel composites with different hexagonal boron nitride(h-BN)fillers were synthesized and successfully 3D-printed while their thermal conductivity was systematically studied.With the content of h-BN increasing from 0.1 wt%to 0.3 wt%,the thermal conductivity of the 3D-printed composites has been improved.Moreover,through the shear force given by the 3D printer,a complete thermal conductivity path is obtained inside the hydrogel,which significantly improves the thermal conductivity of the h-BN hydrogel composites.The maximum thermal conductivity is 0.8808 W/(m·K),leading to a thermal conductive enhancement of 1000%,compared with the thermal conductivity of pure PAA hydrogels.This study shows that using h-BN fillers can effectively and significantly improve the thermal conductivity of hydrogelbased materials while its 3D-printable ability has been maintained.展开更多
基金Funed by the National Key Research and Development Program of China(No.2021YFA0715700)the Open Fund of Hubei Longzhong Laboratory。
文摘Polyacrylic acid(PAA)hydrogel composites with different hexagonal boron nitride(h-BN)fillers were synthesized and successfully 3D-printed while their thermal conductivity was systematically studied.With the content of h-BN increasing from 0.1 wt%to 0.3 wt%,the thermal conductivity of the 3D-printed composites has been improved.Moreover,through the shear force given by the 3D printer,a complete thermal conductivity path is obtained inside the hydrogel,which significantly improves the thermal conductivity of the h-BN hydrogel composites.The maximum thermal conductivity is 0.8808 W/(m·K),leading to a thermal conductive enhancement of 1000%,compared with the thermal conductivity of pure PAA hydrogels.This study shows that using h-BN fillers can effectively and significantly improve the thermal conductivity of hydrogelbased materials while its 3D-printable ability has been maintained.
