The traditional power design, construction, has been able to meet the requirements, but it has not been established engineering data database support and the correlation between the data is poor, due to inadequate coo...The traditional power design, construction, has been able to meet the requirements, but it has not been established engineering data database support and the correlation between the data is poor, due to inadequate coordination among design professionals, design easily lead to mistakes, field problems, and design results failed in all aspects of the project to be fully utilized. With the technology of three-dimensional integrated design system penetrates in all walks of life, the introduction of three-dimensional integrated design system substation design solutions and the application of common devices of State Grid Corporation in recent years, which provide technical conditions for the application of virtual reality technology in substation design. According to its own characteristics of substation project, we now propose prospect on virtual reality technology in substation design application.展开更多
Ag-Cu bimetallic nanoalloy,integrating the advantages of reducing migration and cost of nano-Ag and alleviating oxidation of nano-Cu,is a prospective bonding material for power electronic packaging.The Ag-coated Cu na...Ag-Cu bimetallic nanoalloy,integrating the advantages of reducing migration and cost of nano-Ag and alleviating oxidation of nano-Cu,is a prospective bonding material for power electronic packaging.The Ag-coated Cu nanoparticles(Cu@Ag NPs)paste can execute bonding with high quality at 250℃,and the achieved supersaturated Ag-Cu nanoalloy joint with ultrahigh shear strength(152 MPa)dramatically exceeds most nano-paste joints.The interstitial solid solutions with atomic-level metallurgical bonds at the interface dominantly promoted the shear strength.Besides,the numerous ultrafine nanograin,high proportion of low angle grain boundaries(7.44%)without deformation,and the Cu nanoprecipitates in the joint would improve subordinately.Furthermore,the high content(16.8%)of∑3 twin boundaries would contribute to the electrical and thermal conductivity.Thus,the multiple strengthening mechanisms with the solid solution,the second precipitated phase,and ultrafine nanograin can dramatically enhance shear strength and electro-thermal conductivity of joints for high-temperature device packaging.展开更多
文摘The traditional power design, construction, has been able to meet the requirements, but it has not been established engineering data database support and the correlation between the data is poor, due to inadequate coordination among design professionals, design easily lead to mistakes, field problems, and design results failed in all aspects of the project to be fully utilized. With the technology of three-dimensional integrated design system penetrates in all walks of life, the introduction of three-dimensional integrated design system substation design solutions and the application of common devices of State Grid Corporation in recent years, which provide technical conditions for the application of virtual reality technology in substation design. According to its own characteristics of substation project, we now propose prospect on virtual reality technology in substation design application.
基金This work was financially supported by the National Natu-ral Science Foundation of China(No.NSFC 51775140)A part of the work was also supported by the National Science and Technology Major Project(No.2017-VI-0009-0080)+2 种基金the Guangdong Province key research and development program(No.2019B010935001)the Shenzhen Science and Technology Plan(No.JCYJ20180507183511908)Bureau of Industry and Information Technology of Shenzhen through the Innovation Chain and Industry Chain(No.201806071354163490).
文摘Ag-Cu bimetallic nanoalloy,integrating the advantages of reducing migration and cost of nano-Ag and alleviating oxidation of nano-Cu,is a prospective bonding material for power electronic packaging.The Ag-coated Cu nanoparticles(Cu@Ag NPs)paste can execute bonding with high quality at 250℃,and the achieved supersaturated Ag-Cu nanoalloy joint with ultrahigh shear strength(152 MPa)dramatically exceeds most nano-paste joints.The interstitial solid solutions with atomic-level metallurgical bonds at the interface dominantly promoted the shear strength.Besides,the numerous ultrafine nanograin,high proportion of low angle grain boundaries(7.44%)without deformation,and the Cu nanoprecipitates in the joint would improve subordinately.Furthermore,the high content(16.8%)of∑3 twin boundaries would contribute to the electrical and thermal conductivity.Thus,the multiple strengthening mechanisms with the solid solution,the second precipitated phase,and ultrafine nanograin can dramatically enhance shear strength and electro-thermal conductivity of joints for high-temperature device packaging.
