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A review on GaN HEMTs:nonlinear mechanisms and improvement methods
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作者 Chenglin Du Ran Ye +5 位作者 Xiaolong Cai xiangyang duan Haijun Liu Yu Zhang Gang Qiu Minhan Mi 《Journal of Semiconductors》 EI CAS CSCD 2023年第12期31-46,共16页
The GaN HEMT is a potential candidate for RF applications due to the high frequency and large power handling capability.To ensure the quality of the communication signal,linearity is a key parameter during the system ... The GaN HEMT is a potential candidate for RF applications due to the high frequency and large power handling capability.To ensure the quality of the communication signal,linearity is a key parameter during the system design.However,the GaN HEMT usually suffers from the nonlinearity problems induced by the nonlinear parasitic capacitance,transconductance,channel transconductance etc.Among them,the transconductance reduction is the main contributor for the nonlinearity and is mostly attributed to the scattering effect,the increasing resistance of access region,the self-heating effect and the trapping effects.Based on the mechanisms,device-level improvement methods of transconductance including the trapping suppression,the nanowire channel,the graded channel,the double channel,the transconductance compensation and the new material structures have been proposed recently.The features of each method are reviewed and compared to provide an overview perspective on the linearity of the GaN HEMT at the device level. 展开更多
关键词 GaN HEMT linearity improvement transconductance reduction transconductance compensation nanowire channel graded channel
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Codebook Design and Beam Training for Extremely Large-Scale RIS:Far-Field or Near-Field? 被引量:9
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作者 Xiuhong Wei Linglong Dai +2 位作者 Yajun Zhao Guanghui Yu xiangyang duan 《China Communications》 SCIE CSCD 2022年第6期193-204,共12页
Reconfigurable intelligent surface(RIS)is more likely to develop into extremely large-scale RIS(XL-RIS)to efficiently boost the system capacity for future 6 G communications.Beam training is an effective way to acquir... Reconfigurable intelligent surface(RIS)is more likely to develop into extremely large-scale RIS(XL-RIS)to efficiently boost the system capacity for future 6 G communications.Beam training is an effective way to acquire channel state information(CSI)for XL-RIS.Existing beam training schemes rely on the far-field codebook.However,due to the large aperture of XL-RIS,the scatters are more likely to be in the near-field region of XL-RIS.The far-field codebook mismatches the near-field channel model.Thus,the existing far-field beam training scheme will cause severe performance loss in the XL-RIS assisted nearfield communications.To solve this problem,we propose the efficient near-field beam training schemes by designing the near-field codebook to match the nearfield channel model.Specifically,we firstly design the near-field codebook by considering the near-field cascaded array steering vector of XL-RIS.Then,the optimal codeword for XL-RIS is obtained by the exhausted training procedure.To reduce the beam training overhead,we further design a hierarchical nearfield codebook and propose the corresponding hierarchical near-field beam training scheme,where different levels of sub-codebooks are searched in turn with reduced codebook size.Simulation results show the proposed near-field beam training schemes outperform the existing far-field beam training scheme. 展开更多
关键词 extremely large-scale RIS near-field codebook design beam training
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Recent progress of physical failure analysis of GaN HEMTs 被引量:1
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作者 Xiaolong Cai Chenglin Du +5 位作者 Zixuan Sun Ran Ye Haijun Liu Yu Zhang xiangyang duan and Hai Lu 《Journal of Semiconductors》 EI CAS CSCD 2021年第5期48-59,共12页
Gallium nitride(GaN)-based high-electron mobility transistors(HEMTs) are widely used in high power and high frequency application fields, due to the outstanding physical and chemical properties of the GaN material. Ho... Gallium nitride(GaN)-based high-electron mobility transistors(HEMTs) are widely used in high power and high frequency application fields, due to the outstanding physical and chemical properties of the GaN material. However, GaN HEMTs suffer from degradations and even failures during practical applications, making physical analyses of post-failure devices extremely significant for reliability improvements and further device optimizations. In this paper, common physical characterization techniques for post failure analyses are introduced, several failure mechanisms and corresponding failure phenomena are reviewed and summarized, and finally device optimization methods are discussed. 展开更多
关键词 GAN high electron mobility transistors physical analysis failure mechanism
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