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DISPERSION OF NANODIAMOND AND ULTRA-FINE POLISHING OF QUARTZ WAFER 被引量:1
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作者 YongweiZhu ZhijingFeng +1 位作者 BaichunWang xianyangxu 《China Particuology》 SCIE EI CAS CSCD 2004年第4期153-156,共4页
Mechanochemical Modification (MCM) of nanodiamond surface with DN-10 was studied in relation to the performance of nanodiamond in polishing quartz wafers. Results show that the modified nanodiamond is more stable in t... Mechanochemical Modification (MCM) of nanodiamond surface with DN-10 was studied in relation to the performance of nanodiamond in polishing quartz wafers. Results show that the modified nanodiamond is more stable in the pH range 8~11. A super smooth surface with an average roughness of 0.214 nm was achieved using a nanodia-mond-based slurry regulated by N-(2-hydroxyethyl)ethylenediamine. It is suggested that the principal ultra-fine polishing mechanism of quartz wafer involves atom-level removal under the synergism of chemical and mechanical actions. 展开更多
关键词 NANODIAMOND DISPERSION mechanochemical modification ultra-fine polishing quartz wafer
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