The three-layered(W-60 vol%Cu/W-40 vol%Cu/W-20 vol%Cu)W/Cu functionally graded material(FGM)containing a Cu network structure was fabricated at different temperatures by hot-pressed sintering produced from copper-coat...The three-layered(W-60 vol%Cu/W-40 vol%Cu/W-20 vol%Cu)W/Cu functionally graded material(FGM)containing a Cu network structure was fabricated at different temperatures by hot-pressed sintering produced from copper-coated tungsten powders.The effects of various sintering temperatures on relative density,microstructure,thermal conductivity,hardness and flexural strength were investigated.Scanning electron microscopy(SEM)and X-ray diffraction(XRD)analysis show that a Cu network extends throughout the W/Cu FGM specimens sintered at 1065℃and the graded structure can be retained perfectly,and W particles are distributed homogeneously.The low-temperature sintering densification of W/Cu FGM arises because the sintering mode of the copper-coated tungsten particles includes just sintering Cu to Cu,rather than Cu to W,Cu to Cu and W to W,as required for conventional powder particles.The relative density of W/Cu FGM sintered at 1065℃for 3 h under a load of25 MPa is 96.1%.The thermal conductivity is up to204 W·m^-1·K^-1 at normal temperature and 150 W·m^-1·K^-1at 800℃.And the Vickers hardness varies with the gradient of different layers from 3.34 to 4.05 GPa.展开更多
基金financially supported by the Wenzhou Public Welfare Technology Research Industry Project(No.G20140042)。
文摘The three-layered(W-60 vol%Cu/W-40 vol%Cu/W-20 vol%Cu)W/Cu functionally graded material(FGM)containing a Cu network structure was fabricated at different temperatures by hot-pressed sintering produced from copper-coated tungsten powders.The effects of various sintering temperatures on relative density,microstructure,thermal conductivity,hardness and flexural strength were investigated.Scanning electron microscopy(SEM)and X-ray diffraction(XRD)analysis show that a Cu network extends throughout the W/Cu FGM specimens sintered at 1065℃and the graded structure can be retained perfectly,and W particles are distributed homogeneously.The low-temperature sintering densification of W/Cu FGM arises because the sintering mode of the copper-coated tungsten particles includes just sintering Cu to Cu,rather than Cu to W,Cu to Cu and W to W,as required for conventional powder particles.The relative density of W/Cu FGM sintered at 1065℃for 3 h under a load of25 MPa is 96.1%.The thermal conductivity is up to204 W·m^-1·K^-1 at normal temperature and 150 W·m^-1·K^-1at 800℃.And the Vickers hardness varies with the gradient of different layers from 3.34 to 4.05 GPa.
