基于d电子理论的Ti-Nb-Cu三元形状记忆合金性能优化

基于d电子理论设计Ti-Nb-Cu形状记忆合金的相组成,以优化其性能。XRD分析和TEM观察表明,Cu添加导致键级(Bo)和金属d轨道能级(Md)值减小,从而使相组成发生演变。随着Cu含量的增加,相组成的变化可以总结如下:β+α"→β+ω→β+α"+ω→β。随着Cu含量的增加,Ti-Nb-Cu形状记忆合金的屈服强度、极限抗拉强度和伸长率均呈先增大后减小的趋势。通过优化Cu合金元素含量,Ti-Nb-Cu形状记忆合金具有优异的力学性能,其屈服强度为528 MPa,极限抗拉强度为742 MPa,这主要归因于固溶强化、晶粒细化以及析出强化的综合作用。

Effect of Sn Content on the Microstructural Features, Martensitic Transformation and Mechanical Properties in Ti-V-Al-Based Shape Memory Alloys

In the present study, it is expected to tailor the microstructural features, martensitic transformation temperatures and mechanical properties of Ti-V-Al shape memory alloys through adding Sn alloying elements, which further expands their applications. Sn addition results in the monotonous rising of average valence electron number (e/a). In proportion, the single α″ martensite phase directly evolves into merely β parent phase in present Ti-V-Al-based shape memory alloys, as Sn content increases from 0.5 to 5.0 at.%. Meanwhile, Sn addition causes the reduction in the grain size. Combined with transmission electron microscopy (TEM) observation and d electron theory analysis, it can be speculated that Sn addition can suppress the precipitation of ω phase. With increasing Sn content, fracture strength invariably decreases from 962 to 792 MPa, whereas the yield strength firstly decreases and then increases. The lowest yield stress for the stress-induced martensitic transformation of 220 MPa can be obtained in Ti-V-Al shape memory alloy by adding 3.0 at.% Sn. By optimizing 1.0 at.% Sn, the excellent ductility with a largest elongation of 42.1% can be gained in Ti-V-Al shape memory alloy, which is larger than that of the reported Ti-V-Al-based shape memory alloys. Besides, as a result of solution strengthening and grain refinement, Ti-V-Al-based shape memory alloy with 5.0 at.% Sn possesses the highest yield strength, further contributing to the excellent strain recovery characteristics with 4% fully recoverable strain.

Deposition and characterization for high-quality Ti-Ni-Cu thin films with higher Cu content

In order to attain high-quality Ti-Ni-Cu film,the surface morphologies,chemical compositions and mechanical properties of Ti-Ni-Cu thin films prepared by direct current(DC)magnetron sputtering at various processes were characterized by scanning electron microscopy(SEM),X-ray diffractometer(XRD)and tensile tests.The type of substrates,Ar pressure and sputtering power had significant effects on the quality and chemical composition of Ti-Ni-Cu thin film.Compared with Si and SiO_(2) slides,it was easier to obtain freestanding films by adopting glass or piezoid slide as substrates.The Ti-Ni-Cu thin film deposited at lower pressure(0.10 Pa)had a better density.The surface was featured with porous structure in the Ti-Ni-Cu thin film prepared by higher Ar pressure of 0.36 Pa.In addition,both the tensile strength and strain of annealed Ti-Ni-Cu thin film continuously increased with Ar pressure decreasing.Higher density contributed to the superior mechanical properties.The deposition rate firstly increased and then decreased with Ar pressure and sputtering power increasing.The composition of deposited Ti-Ni-Cu film can be tailored by changing sputter power.The deposited Ti-Ni-Cu thin films at different processing parameters were in amorphous state.In short,the present study offered the important theoretical basis for the preparation of Ti-Ni-Cu thin film with higher quality and performance.