Recyclability and self-healing are two most critical factors in developing sustainable polymers to deal with environmental pollution and resource waste.In this work,a dynamic cross-linked polyimide insulation film wit...Recyclability and self-healing are two most critical factors in developing sustainable polymers to deal with environmental pollution and resource waste.In this work,a dynamic cross-linked polyimide insulation film with full closed-loop recyclability is successfully prepared,which also possesses good self-healing ability after being mechanical/electrical damaged depending on the Schiff base dynamic covalent bonds.The recycled and self-healed polyimide film still maintain its good tensile strength(r t)>60 MPa with Young’s modulus(E)>4 GPa,high thermal stability with glass transition temperature(T g)>220℃,and outstanding insulation property with breakdown strength(E 0)>358 kV mm^(-1),making it a very promising low energy consumption and high temperature resistant insulation material.The strategy of using Schiff base dynamic covalent bonds for reversible repairing the structure of high T g polyimides promotes the wider application of such sustainable and recyclable material in the field of electrical power and micro-electronics.展开更多
基金This work was financially supported by the National Natural Science Foundation of China (No.51977114,52177020)Fundamental Research Funds for the Central Universities (No.FRF-NP-19-008 and FRF-TP-20-02B2)Scientific and Techno-logical Innovation Foundation of Foshan (BK21BE006).
文摘Recyclability and self-healing are two most critical factors in developing sustainable polymers to deal with environmental pollution and resource waste.In this work,a dynamic cross-linked polyimide insulation film with full closed-loop recyclability is successfully prepared,which also possesses good self-healing ability after being mechanical/electrical damaged depending on the Schiff base dynamic covalent bonds.The recycled and self-healed polyimide film still maintain its good tensile strength(r t)>60 MPa with Young’s modulus(E)>4 GPa,high thermal stability with glass transition temperature(T g)>220℃,and outstanding insulation property with breakdown strength(E 0)>358 kV mm^(-1),making it a very promising low energy consumption and high temperature resistant insulation material.The strategy of using Schiff base dynamic covalent bonds for reversible repairing the structure of high T g polyimides promotes the wider application of such sustainable and recyclable material in the field of electrical power and micro-electronics.
