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Effect of Stress-Dependent Thermal Conductivity on Thermo-Mechanical Coupling Behavior in GaN-Based Nanofilm Under Pulse Heat Source 被引量:1
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作者 Qicong Li xiaoya tang +1 位作者 Linli Zhu Haihui Ruan 《Acta Mechanica Solida Sinica》 SCIE EI CSCD 2021年第1期27-39,共13页
The thermal properties of a nanostructured semiconductor are affected by multi-physical fields,such as stress and electromagnetic fields,causing changes in temperature and strain distributions.In this work,the influen... The thermal properties of a nanostructured semiconductor are affected by multi-physical fields,such as stress and electromagnetic fields,causing changes in temperature and strain distributions.In this work,the influence of stress-dependent thermal conductivity on the heat transfer behavior of a GaN-based nanofilm is investigated.The finite element method is adopted to simulate the temperature distribution in a prestressed nanofilm under heat pulses.Numerical results demonstrate the effect of stress field on the thermal conductivity of GaN-based nanofilm,namely,the prestress and the thermal stress lead to a change in the heat transfer behavior in the nanofilm.Under the same heat source,the peak temperature of the film with stress-dependent thermal conductivity is significantly lower than that of the film with a constant thermal conductivity and the maximum temperature difference can reach 8.2 K.These results could be useful for designing GaN-based semiconductor devices with higher reliability under multi-physical fields. 展开更多
关键词 Multi-physical effect Stress-dependent thermal conductivity Prestress fields Heat transfer behavior GaN-based nanofilm Finite element method
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