Analysis of high-temperature performance of 4H-SiC avalanche photodiodes in both linear and Geiger modes

The high-temperature performance of 4H-SiC ultraviolet avalanche photodiodes(APDs)in both linear and Geiger modes is extensively investigated.During the temperature-dependent measurements,a fixed bias voltage is adopted for the device samples,which is much more practical and important for high-temperature applications.The results show that the fabricated 4H-SiC APDs are very stable and reliable at high temperatures.As the temperature increases from room temperature to 425 K,the dark current at 95%of the breakdown voltage increases slightly and remains lower than40 pA.In Geiger mode,our 4H-SiC APDs can be self-quenched in a passive-quenching circuit,which is expected for highspeed detection systems.Moreover,an interesting phenomenon is observed for the first time:the single-photon detection efficiency shows a non-monotonic variation as a function of temperature.The physical mechanism of the variation in hightemperature performance is further analyzed.The results in this work can provide a fundamental reference for researchers in the field of 4H-SiC APD ultraviolet detectors.

Performance analysis of GaN-based high-electron-mobility transistors with postpassivation plasma treatment

AlGaN/GaN high-electron-mobility transistors(HEMTs)with postpassivation plasma treatment are demonstrated and investigated for the first time.The results show that postpassivation plasma treatment can reduce the gate leakage and enhance the drain current.Comparing with the conventional devices,the gate leakage of Al Ga N/Ga N HEMTs with postpassivation plasma decreases greatly while the drain current increases.Capacitance-voltage measurement and frequencydependent conductance method are used to study the surface and interface traps.The mechanism analysis indicates that the surface traps in the access region can be reduced by postpassivation plasma treatment and thus suppress the effect of virtual gate,which can explain the improvement of DC characteristics of devices.Moreover,the density and time constant of interface traps under the gate are extracted and analyzed.