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AgGeSbTe thin film as a negative heat-mode resist for dry lithography 被引量:3
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作者 xingwang chen Lei chen +7 位作者 Ying Wang Tao Wei jing Hu Miao cheng Qianqian Liu Wanfei Li Yun Ling Bo Liu 《Chinese Optics Letters》 SCIE EI CAS CSCD 2022年第3期72-76,共5页
An AgGeSbTe thin film is proposed as a negative heat-mode resist for dry lithography.It possesses high etching selectivity with the etching rate difference of as high as 62 nm/min in CHF_(3)/O_(2)mixed gases.The etche... An AgGeSbTe thin film is proposed as a negative heat-mode resist for dry lithography.It possesses high etching selectivity with the etching rate difference of as high as 62 nm/min in CHF_(3)/O_(2)mixed gases.The etched sidewall is steep without the obvious lateral corrosion.The lithographic characteristics and underlying physical mechanisms are analyzed.Besides,results of X-ray diffraction,Raman spectroscopy,and X-ray photoelectron spectroscopy further indicate that laser irradiation causes the formation of Ge,Sb,and AgTe crystals,which is the basis of etching selectivity.In addition,the etching selectivity of Si to AgGeS_(b)Te resist is as high as 19 at SF_(6)/Ar mixed gases,possessing good etching resistance.It is believed that the AgGeSbTe thin film is a promising heat-mode resist for dry lithography. 展开更多
关键词 thin film heat-mode resist LITHOGRAPHY
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