Recently,the performance and fabrication of thin-ilm thermoeletric materials have been jargely enhanced.Based on this enhancement,the thin-film thermoelectric cooler(TEC)is becoming a research hot topic,due to its hig...Recently,the performance and fabrication of thin-ilm thermoeletric materials have been jargely enhanced.Based on this enhancement,the thin-film thermoelectric cooler(TEC)is becoming a research hot topic,due to its high cooling flux and microchip level size.To fulfill a thin-film TEC,interfacial problems are unavoidable,as they may largely reduce the properties of a thin-film TEC.Moreover,the architecture of a thin-film TEC should also be properly designed.In this review,we introduced the enhancement of thermoelectric properties of(Bi,Sb)2(Te,Se)3 solid solution materials by chemical vapor deposition,physical vapor deposition and electro-deposition.Then,the interfacial problems,including contact resistance,interfacial diffusion and thermal contact resistance,were discussed.Furthermore,the design,fabrication,as well as the performance of thin-film TECs were summarized.展开更多
基金supported by the State Key Program of National Natural Science Foundation of China(Grant No.61534001)the Joint Funds of the National Natural Science Foundation of China(Grant No.U1601213)+2 种基金the National Natural Science Foundation of China(Grant Nos.51601005 and 61704006)the Beijing Natural Science Foundation(Grant No.2182032)the Fundamental Research Funds for the Central Universities.
文摘Recently,the performance and fabrication of thin-ilm thermoeletric materials have been jargely enhanced.Based on this enhancement,the thin-film thermoelectric cooler(TEC)is becoming a research hot topic,due to its high cooling flux and microchip level size.To fulfill a thin-film TEC,interfacial problems are unavoidable,as they may largely reduce the properties of a thin-film TEC.Moreover,the architecture of a thin-film TEC should also be properly designed.In this review,we introduced the enhancement of thermoelectric properties of(Bi,Sb)2(Te,Se)3 solid solution materials by chemical vapor deposition,physical vapor deposition and electro-deposition.Then,the interfacial problems,including contact resistance,interfacial diffusion and thermal contact resistance,were discussed.Furthermore,the design,fabrication,as well as the performance of thin-film TECs were summarized.
