Due to the wide application of ceramics in electronic device packaging,the performance of ceramic metallization layer directly determines the performance of the whole package device.This paper introduces the main prep...Due to the wide application of ceramics in electronic device packaging,the performance of ceramic metallization layer directly determines the performance of the whole package device.This paper introduces the main preparation methods of ceramic metallization,discusses the influence of Mo powder size,metallization formula,sintering temperature and other factors on the performance of ceramic metallization layer prepared by activated Mo-Mn method,and introduces several kinds of methods that can be tested to test the performance of ceramic metallized sealing samples.A new research direction of Ceramic Metallization Technology in the advanced field is put forward.展开更多
基金The authors are grateful to National Science Foundation of China(51602347)Hunan Natural Science Foundation(2019JJ50282)for financial support.The authors are also grateful to Aid Program for Innovative Group of National University of Defense Technology and Aid Program for Science and Technology Innovative Research Team in Higher Educational Institutions of Hunan Province.
文摘Due to the wide application of ceramics in electronic device packaging,the performance of ceramic metallization layer directly determines the performance of the whole package device.This paper introduces the main preparation methods of ceramic metallization,discusses the influence of Mo powder size,metallization formula,sintering temperature and other factors on the performance of ceramic metallization layer prepared by activated Mo-Mn method,and introduces several kinds of methods that can be tested to test the performance of ceramic metallized sealing samples.A new research direction of Ceramic Metallization Technology in the advanced field is put forward.
