Preparation and particle size characterization of Cu nanoparticles prepared by anodic arc plasma

Copper nanoparticles were successfully prepared in large scale by means of anodic arc discharging plasma method in inert atmosphere. The particle size, specific surface area, crystal structure, and morphology of the samples were characterized by X-ray diffraction （XRD）, BET equation, transmission electron microscopy （TEM）, and the corresponding selected area electron diffraction （SAED）. The experimental results indicate that the crystal structure of the samples is fcc structure the same as that of the bulk materials. The specific surface area is 11 m^2/g, the particle size distribution is 30 to 90 nm, and the average particle size is about 67 nm obtained from TEM and confirmed from XRD and BET results. The nanoparticles with uniform size, high purity, narrow size distribution and spherical shape can be prepared by this convenient and effective method.

A comparative study of the properties of TiN films deposited by MAIP and FCAP

In this study two types of TIN films were prepared, one using the filtered cathodic arc plasma （FCAP） technique with an in-plane ＂S＂ triter, and the other using the multi-arc ion-plating （MAIP）, and both deposited under the same parameters. Comparisons of the texture, hardness, roughness, tribological and electrochemical corrosion behaviors of the two types of TiN films were given. The TiN films obtained by the FCAP technology were found to be highly uniform, smooth and macroparticle-free. The TiN films deposited by FCAP had a （111） preferred orientation, while there was no texture in the films deposited by MAIP. Under low load the two kinds of TiN coatings had very different wear mechanisms; the films of FCAP had a lower wear rate and friction coefficient compared with the TiN films deposited by the MAIP technique. The dense and hole-free structure of TiN films of FCAP could effectively avoid the avalanche of TiN films from the substrate during corrosion tests.

Influences of deposition parameters on the microstructure and properties of nanostructural TiN films synthesized by filtered cathodic arc plasma

Titanium nitride （TIN） films with nanostructure were prepared at ambient temperature on a （111） silicon substrate by the filtered cathodic arc plasma （FCAP） technology with an in-plane ＂S＂ filter. The effects of deposition parameters on the grain size, texture and nano-hardness of the films were systematically investigated. The grain size was obtained through calculation using the Scherrer formula and observed by TEM. The results of X-ray diffraction and electron diffraction indicated that increasing either negative substrate bias or argon flow promoted the formation of （111） preferred orientation. High argon flow leads to biaxial texture. The micro-hardness of the TIN films as a function of grain size showed a behavior according to the Hall-Petch relation under high argon flow.

High-Power-Density Plasma Deposition of Diamond-Like Carbons Films

We present a new method utilizing a high-power-density plasma for depositing diamond-like carbon(DLC)films.The main advantage of this technique is the possibility that films with good adhesion to the substrate can be prepared under room temperature and low pressure.The DLC films are deposited on the silicon substrate successfully.The structure of the DLC films was characterized by high energy electron diffraction,scanning electron microscopy,Raman spectroscopy,x-ray photoelectron spectroscopy,and infrared absorption spectrum.